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Keywords: sub-ambient pressure
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Journal Articles
Publisher: ASME
Article Type: Article
J. Tribol. April 2005, 127(2): 287–292.
Published Online: April 7, 2005
... fluid pressure. Experimental measurements revealed that a sub-ambient pressure exists in the contact interface between a rigid flat (used to simulate the wafer) and the polishing pad 1 . The magnitude of this sub-ambient pressure can be on the order of the applied load. This could change the contact...