...Adam Wilczek This paper presents the experimental study of the construction features of a thin-layer sensor on the accuracy of pressure measurements in an EHD contact. Two common types of transducer shapes and isolating layers of the sensor, made of SiO are considered. The measurements were carried...

...Adam Wilczek This paper presents a model study of inductive, capacitive, and piezoelectric effects on the accuracy of pressure measurements in an EHD contact. Circuit and mathematical models of a thin-layer sensor and a measurement system were developed. It has been assumed that isolation layers...

... of the disk as a dominant factor in causing the negative pressure phenomenon. Manuscript received February 25, 2004; revision received May 28, 2004. Review conducted by: J. Tichy. 25 February 2004 28 May 2004 07 02 2005 chemical mechanical polishing pressure measurement...

... phenomena pressure measurement elastic moduli permeability Chemical mechanical polishing (CMP) is used as one of the critical processes in integrated circuit (IC) chip fabrication. The process is a micromachining technology whereby a silicon wafer surface is pressed against a compliant surface...

... received by the Tribology Division February 27, 2001; revised manuscript received May 22, 2001. Associate Editor: C. H. Venner. 22 October 2001 27 February 2001 22 May 2001 pressure measurement Raman spectroscopy mechanical contact stress analysis rolling friction rheology...

... is used to filter the high frequency temporal fluctuations in the measurements of the dynamic pressure fields. Figure 4 represents the period-averaged pressure measurements at (0 deg, Z 2 ) for a full cycle of journal motion. This waterfall-type graph shows the reduction in dynamic pressures...