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Journal Articles

Tribological Characteristics of Tantalum-Oxide Coating Fabricated on Pre-Treated 2024 Aluminum Alloys

Sevda Albayrak, Canser Gül, Hanifi Çinici, Ömer Şahin
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. October 2023, 145(10): 101706.
Paper No: TRIB-23-1088
https://doi.org/10.1115/1.4062721
Published Online: June 26, 2023
View Article titled, Tribological Characteristics of Tantalum-Oxide Coating Fabricated on Pre-Treated 2024 Aluminum Alloys
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Topics: Aluminum alloys, Coating processes, Coatings, Tantalum, Wear, Polishing, Tribology, Wear testing
Journal Articles

Effect of Sliding Velocity on UHMWPE and VEXLPE Friction Against CoCr in Multidirectional, Serum Lubricated Conditions

Vesa Saikko, Omar Morad, Raine Viitala
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Briefs
J. Tribol. March 2023, 145(3): 034501.
Paper No: TRIB-22-1298
https://doi.org/10.1115/1.4056224
Published Online: November 23, 2022
View Article titled, Effect of Sliding Velocity on UHMWPE and VEXLPE Friction Against CoCr in Multidirectional, Serum Lubricated Conditions
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Topics: Disks, Friction, Lubrication, Polishing
Journal Articles

Tribo-Oxidation and Tribological Behavior of TaC–20%SiC Composites at Elevated Temperatures

Zihao Wu, Shubo Zhang, Hao Chen, Wanxiu Hai, Meiling Liu, Wenzhou Sun, Falian Qin
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. February 2023, 145(2): 021701.
Paper No: TRIB-21-1457
https://doi.org/10.1115/1.4055845
Published Online: October 26, 2022
View Article titled, Tribo-Oxidation and Tribological Behavior of TaC–20%SiC Composites at Elevated Temperatures
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Topics: Composite materials, Oxidation, Temperature, Tribology, Wear, Friction, Polishing
Journal Articles

On the Planarization Mechanism and Pad Aging Effects of Soft Pad Polishing: A Perspective From the Micro-Mechanical Properties of Soft Pads

Yeau-Ren Jeng, Ping-Chi Tsai, Yu-Zheng Lin
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research-Article
J. Tribol. June 2019, 141(6): 064501.
Paper No: TRIB-17-1422
https://doi.org/10.1115/1.4043348
Published Online: April 18, 2019
View Article titled, On the Planarization Mechanism and Pad Aging Effects of Soft Pad Polishing: A Perspective From the Micro-Mechanical Properties of Soft Pads
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Topics: Polishing, Testing, Microscale devices, Storage, Dynamic testing (Materials)
Journal Articles

The Effects of Microdimple Texture on the Friction and Thermal Behavior of a Point Contact

S. Li, U. Parmar
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research-Article
J. Tribol. July 2018, 140(4): 041503.
Paper No: TRIB-17-1417
https://doi.org/10.1115/1.4039228
Published Online: March 2, 2018
View Article titled, The Effects of Microdimple Texture on the Friction and Thermal Behavior of a Point Contact
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Topics: Disks, Friction, Lubrication, Pressure, Stress, Surface texture, Temperature, Texture (Materials), Surface roughness, Tribology
Journal Articles

Effect of CoCr Counterface Roughness on the Wear of UHMWPE in the Noncyclic RandomPOD Simulation

Vesa Saikko, Vesa Vuorinen, Hannu Revitzer
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research-Article
J. Tribol. March 2017, 139(2): 021606.
Paper No: TRIB-16-1008
https://doi.org/10.1115/1.4033648
Published Online: August 11, 2016
View Article titled, Effect of CoCr Counterface Roughness on the Wear of UHMWPE in the Noncyclic RandomPOD Simulation
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Topics: Knee, Simulation, Surface roughness, Wear, Disks, Polishing
Journal Articles

Frictional Behavior and Topography of Porous Polyurethane on Copper and Silicon Dioxide Articulating Contacts

David C. Ponte, D. M. L. Meyer
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research-Article
J. Tribol. July 2016, 138(3): 031604.
Paper No: TRIB-15-1302
https://doi.org/10.1115/1.4032523
Published Online: April 25, 2016
View Article titled, Frictional Behavior and Topography of Porous Polyurethane on Copper and Silicon Dioxide Articulating Contacts
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Topics: Copper, Polymers, Pressure, Silicon, Tribometers, Uncertainty, Urethane elastomers, Surface roughness, Tribology, Uncertainty analysis
Journal Articles

Investigation of Protein Adsorption Mechanism and Biotribological Properties at Simulated Stem-Cement Interface

Hongyu Zhang, Shaohua Zhang, Jianbin Luo, Yuhong Liu, Shanhua Qian, Fanghui Liang, Yongling Huang
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research-Article
J. Tribol. July 2013, 135(3): 032301.
Paper No: TRIB-11-1217
https://doi.org/10.1115/1.4023802
Published Online: April 29, 2013
View Article titled, Investigation of Protein Adsorption Mechanism and Biotribological Properties at Simulated Stem-Cement Interface
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Topics: Bone, Cements (Adhesives), Polishing, Proteins, Tribology, Stainless steel, Disks, Biotribology, Titanium alloys, Pins (Engineering)
Journal Articles

Analysis of Laminar Flow Over a Non-Conventional Random Rough Surface Based on Lattice Boltzmann Method

Ping Zhou, Dongming Guo, Renke Kang, Zhuji Jin
Journal: Journal of Tribology
Publisher: ASME
Article Type: Other (Seals, Manufacturing)
J. Tribol. January 2012, 134(1): 012201.
https://doi.org/10.1115/1.4005517
Published Online: February 9, 2012
View Article titled, Analysis of Laminar Flow Over a Non-Conventional Random Rough Surface Based on Lattice Boltzmann Method
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Topics: Flow (Dynamics), Lattice Boltzmann methods, Polishing, Surface roughness, Simulation
Journal Articles

Coffee Stain Ring Effect and Nonuniform Material Removal in Chemical Mechanical Polishing

Jianguo Xin
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. October 2010, 132(4): 041605.
https://doi.org/10.1115/1.4002108
Published Online: October 7, 2010
View Article titled, Coffee Stain Ring Effect and Nonuniform Material Removal in Chemical Mechanical Polishing
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Topics: Evaporation, Flow (Dynamics), Polishing, Semiconductor wafers, Slurries, Microfluidics
Journal Articles

Solution of Reynolds Equation in Polar Coordinates Applicable to Nonsymmetric Entrainment Velocities

Kurt Beschorner, C. Fred Higgs, III, Michael Lovell
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Briefs
J. Tribol. July 2009, 131(3): 034501.
https://doi.org/10.1115/1.3118783
Published Online: May 22, 2009
View Article titled, Solution of Reynolds Equation in Polar Coordinates Applicable to Nonsymmetric Entrainment Velocities
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Topics: Disks, Navier-Stokes equations, Polishing, Pressure, Semiconductor wafers
Journal Articles

A Particle-Augmented Mixed Lubrication Modeling Approach to Predicting Chemical Mechanical Polishing

Elon J. Terrell, C. Fred Higgs, III
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. January 2009, 131(1): 012201.
https://doi.org/10.1115/1.2991173
Published Online: December 2, 2008
View Article titled, A Particle-Augmented Mixed Lubrication Modeling Approach to Predicting Chemical Mechanical Polishing
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Topics: Modeling, Particulate matter, Polishing, Semiconductor wafers, Simulation, Wear, Lubrication, Slurries, Contact mechanics, Particle dynamics
Journal Articles

Comparison of Interfacial Forces During Post-Chemical-Mechanical-Polishing Cleaning

Dedy Ng, Hong Liang
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. April 2008, 130(2): 021603.
https://doi.org/10.1115/1.2908896
Published Online: May 7, 2008
View Article titled, Comparison of Interfacial Forces During Post-Chemical-Mechanical-Polishing Cleaning
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Topics: Adhesion, Drag (Fluid dynamics), Fluids, Friction, Lubrication, Particulate matter, Polishing, Semiconductor wafers, Van der Waals forces, Pressure
Journal Articles

A Modeling Approach for Predicting the Abrasive Particle Motion During Chemical Mechanical Polishing

Elon J. Terrell, C. Fred Higgs III
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Papers
J. Tribol. October 2007, 129(4): 933–941.
https://doi.org/10.1115/1.2768614
Published Online: April 18, 2007
View Article titled, A Modeling Approach for Predicting the Abrasive Particle Motion During Chemical Mechanical Polishing
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Topics: Particulate matter, Semiconductor wafers, Simulation, Slurries, Modeling, Polishing, Flow (Dynamics)
Journal Articles

On the CMP Material Removal at the Molecular Scale

L. Chang
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Briefs
J. Tribol. April 2007, 129(2): 436–437.
https://doi.org/10.1115/1.2647829
Published Online: November 13, 2006
View Article titled, On the CMP Material Removal at the Molecular Scale
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Topics: Chemistry, Particulate matter, Polishing, Semiconductor wafers, Slurries, Semiconductors (Materials)
Journal Articles

Analysis of the Tribological Mechanisms Arising in the Chemical Mechanical Polishing of Copper-Film Wafers When Using a Pad With Concentric Grooves

Jen Fin Lin, Sheng-Chao Chen, Yu Long Ouyang, Ming Shih Tsai
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. July 2006, 128(3): 445–459.
https://doi.org/10.1115/1.2194913
Published Online: March 8, 2006
View Article titled, Analysis of the Tribological Mechanisms Arising in the Chemical Mechanical Polishing of Copper-Film Wafers When Using a Pad With Concentric Grooves
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Topics: Copper, Polishing, Pressure, Semiconductor wafers, Lubrication, Surface roughness, Slurries, Abrasives, Particulate matter
Journal Articles

Revisiting the Removal Rate Model for Oxide CMP

Jamshid Sorooshian, Leonard Borucki, David Stein, Robert Timon, Dale Hetherington, Ara Philipossian
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. July 2005, 127(3): 639–651.
https://doi.org/10.1115/1.1866168
Published Online: June 13, 2005
View Article titled, Revisiting the Removal Rate Model for Oxide CMP
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Topics: Heating, Photovoltaics, Polishing, Pressure, Semiconductor wafers, Temperature, Slurries, Electromagnetic scattering, Silicon
Journal Articles

An Analysis of Mixed Lubrication in Chemical Mechanical Polishing

Sum Huan Ng, C. Fred Higgs,, III, Inho Yoon, Steven Danyluk
Journal: Journal of Tribology
Publisher: ASME
Article Type: Article
J. Tribol. April 2005, 127(2): 287–292.
https://doi.org/10.1115/1.1760551
Published Online: April 7, 2005
View Article titled, An Analysis of Mixed Lubrication in Chemical Mechanical Polishing
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Topics: Flow (Dynamics), Lubrication, Polishing, Pressure, Shear flow, Surface roughness, Fluid pressure
Journal Articles

A Material Removal Rate Model Considering Interfacial Micro-Contact Wear Behavior for Chemical Mechanical Polishing

Yeau-Ren Jeng, Pay-Yau Huang
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Papers
J. Tribol. January 2005, 127(1): 190–197.
https://doi.org/10.1115/1.1828068
Published Online: February 7, 2005
View Article titled, A Material Removal Rate Model Considering Interfacial Micro-Contact Wear Behavior for Chemical Mechanical Polishing
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Topics: Particulate matter, Polishing, Semiconductor wafers, Slurries, Particle size
Journal Articles

Tilt and Interfacial Fluid Pressure Measurements of a Disk Sliding on a Polymeric Pad

Sum Huan Ng, Len Borucki, C. Fred Higgs, III, Inho Yoon, Andre´s Osorno, Steven Danyluk
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Papers
J. Tribol. January 2005, 127(1): 198–205.
https://doi.org/10.1115/1.1829718
Published Online: February 7, 2005
View Article titled, Tilt and Interfacial Fluid Pressure Measurements of a Disk Sliding on a Polymeric Pad
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Topics: Disks, Fluid pressure, Pressure, Semiconductor wafers, Stress, Polishing