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Journal Articles

Effect of Working Fluid, Orientation, and Cooling Mode on Thermal Performance of Miniature Flat Heat Pipe

Jigneshsinh Rathod, Vikas Lakhera, Atindra Shukla
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2023, 15(9): 091011.
Paper No: TSEA-22-1438
https://doi.org/10.1115/1.4062920
Published Online: July 27, 2023
View Article titled, Effect of Working Fluid, Orientation, and Cooling Mode on Thermal Performance of Miniature Flat Heat Pipe
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Topics: Condensers (steam plant), Cooling, Ethanol, Flat heat pipes, Fluids, Forced convection, Heat, Heat pipes, Methanol, Natural convection
Journal Articles

Effects of Thin Film Heat Spreader on Hot Spots Mitigation in Heat Sinks

Sohail Reddy, George S. Dulikravich, Ann-Kayana Blanchard
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. August 2022, 14(8): 081013.
Paper No: TSEA-21-1294
https://doi.org/10.1115/1.4053168
Published Online: February 8, 2022
View Article titled, Effects of Thin Film Heat Spreader on Hot Spots Mitigation in Heat Sinks
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Topics: Graphene, Temperature, Thin films, Diamonds, Thermal conductivity, Flat heat pipes
Journal Articles

An Experimental Investigation of an Oscillating Heat Pipe Heat Spreader

F. F. Laun, H. Lu, H. B. Ma
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. June 2015, 7(2): 021005.
Paper No: TSEA-13-1163
https://doi.org/10.1115/1.4026815
Published Online: June 1, 2015
View Article titled, An Experimental Investigation of an Oscillating Heat Pipe Heat Spreader
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Topics: Cooling, Copper, Flat heat pipes, Heat, Heat pipes, Temperature, Flat plates, Dimensions, Slabs, Condensers (steam plant)
Journal Articles

New Thermal Management Systems for Data Centers

Mayumi Ouchi, Yoshiyuki Abe, Masato Fukagaya, Takashi Kitagawa, Haruhiko Ohta, Yasuhisa Shinmoto, Masahide Sato, Ken-ichi Iimura
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2012, 4(3): 031005.
https://doi.org/10.1115/1.4006478
Published Online: July 16, 2012
View Article titled, New Thermal Management Systems for Data Centers
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Topics: Coolants, Cooling, Cooling systems, Data centers, Flat heat pipes, Flow (Dynamics), Heat, Heat exchangers, Heat pipes, Temperature
Journal Articles

Heat Spreader Based on Room-Temperature Liquid Metal

Yueguang Deng, Jing Liu
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Technical Briefs
J. Thermal Sci. Eng. Appl. June 2012, 4(2): 024501.
https://doi.org/10.1115/1.4006274
Published Online: April 20, 2012
View Article titled, Heat Spreader Based on Room-Temperature Liquid Metal
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Topics: Density, Flat heat pipes, Heat, Heat flux, Liquid metals, Pumps, Temperature, Cooling
Journal Articles

Development of Scalable Silicon Heat Spreader for High Power Electronic Devices

Qingjun Cai, Bing-Chung Chen, Chailun Tsai, Chung-lung Chen
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2009, 1(4): 041009.
https://doi.org/10.1115/1.4001689
Published Online: June 24, 2010
View Article titled, Development of Scalable Silicon Heat Spreader for High Power Electronic Devices
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Topics: Bonding, Flat heat pipes, Pressure, Silicon, Temperature, Vacuum, Vapors, Sealing (Process), Leakage, Heat flux
Journal Articles

Vapor Chamber Acting as a Heat Spreader for Power Module Cooling

Y. P. Zhang, X. L. Yu, Q. K. Feng, L. H. Zhang
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2009, 1(2): 021003.
https://doi.org/10.1115/1.4000285
Published Online: November 4, 2009
View Article titled, Vapor Chamber Acting as a Heat Spreader for Power Module Cooling
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Topics: Cooling, Copper, Flat heat pipes, Heat, Heat sinks, Junctions, Temperature, Thermal resistance, Vapors, Heat flux