Skip to Main Content
Skip Nav Destination

Issues

Research Papers

J. Thermal Sci. Eng. Appl. August 2024, 16(8): 081001. doi: https://doi.org/10.1115/1.4065469
J. Thermal Sci. Eng. Appl. August 2024, 16(8): 081002. doi: https://doi.org/10.1115/1.4065472
J. Thermal Sci. Eng. Appl. August 2024, 16(8): 081003. doi: https://doi.org/10.1115/1.4065471
J. Thermal Sci. Eng. Appl. August 2024, 16(8): 081004. doi: https://doi.org/10.1115/1.4065470
J. Thermal Sci. Eng. Appl. August 2024, 16(8): 081005. doi: https://doi.org/10.1115/1.4065467
J. Thermal Sci. Eng. Appl. August 2024, 16(8): 081006. doi: https://doi.org/10.1115/1.4065489
J. Thermal Sci. Eng. Appl. August 2024, 16(8): 081007. doi: https://doi.org/10.1115/1.4065492
J. Thermal Sci. Eng. Appl. August 2024, 16(8): 081008. doi: https://doi.org/10.1115/1.4065518
J. Thermal Sci. Eng. Appl. August 2024, 16(8): 081009. doi: https://doi.org/10.1115/1.4065722
J. Thermal Sci. Eng. Appl. August 2024, 16(8): 081010. doi: https://doi.org/10.1115/1.4065720

Technical Brief

J. Thermal Sci. Eng. Appl. August 2024, 16(8): 084501. doi: https://doi.org/10.1115/1.4065493
Close Modal

or Create an Account

Close Modal
Close Modal