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Proceedings Papers

Quantitative Description of Vortical Region Length of Non-Newtonian Fluids Through an Abrupt Contraction

J. Z. Liang, Z. Y. Ling, R. K. Y. Li, S. C. Tjong
Proc. ASME. IMECE96, Rheology and Fluid Mechanics of Nonlinear Materials, 105-107, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0236
https://doi.org/10.1115/IMECE1996-0236
View Paper titled, Quantitative Description of Vortical Region Length of Non-Newtonian Fluids Through an Abrupt Contraction
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Topics: Ducts, Extruding, Flow (Dynamics), Fluids, Non-Newtonian fluids, Reservoirs, Rubber compounds, Shear rate, Temperature
Journal Articles

Monitoring on the Auto-Analyzer System in-Statistical-Control for SO 2 in Atmosphere With Top-Down Uncertainty Evaluation

D. W. Wang, H. R. Sun, Z. Q. Pan, Y. Deng, C. Z. Liang, O. Feng
Journal: Journal of Testing and Evaluation
Publisher: ASTM International
Article Type: Technical Notes
J. Test. Eval.. March 2017, 45(2): 704–710.
Paper No: JTE20150257
https://doi.org/10.1520/JTE20150257
Published Online: February 27, 2017
View Article titled, Monitoring on the Auto-Analyzer System in-Statistical-Control for SO 2 in Atmosphere With Top-Down Uncertainty Evaluation
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Proceedings Papers

Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints

Feng Gao, Jianping Jing, Frank Z. Liang, Richard L. Williams, Jianmin Qu
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 729-736, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89098
https://doi.org/10.1115/InterPACK2009-89098
View Paper titled, Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints
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Topics: Brittleness, Failure, Lead-free solders, Solders, Solder joints, Brittle fracture, Failure mechanisms, Design, Dynamic testing (Materials), Finite element analysis
Journal Articles

Loading Mixity on the Interfacial Failure Mode in Lead-Free Solder Joint

Feng Gao, Jianping Jing, Frank Z. Liang, Richard L. Williams, Jianmin Qu
Journal: Journal of ASTM International
Publisher: ASTM International
Article Type: Research-Article
J. ASTM Int.. May 2010, 7(5): 1–15.
https://doi.org/10.1520/JAI103021
Published Online: May 1, 2010
View Article titled, Loading Mixity on the Interfacial Failure Mode in Lead-Free Solder Joint
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Proceedings Papers

Simulation of Dynamic Fracture Along Solder-Pad Interfaces Using a Cohesive Zone Model

Jianping Jing, Feng Gao, Janine Johnson, Frank Z. Liang, Richard L. Williams, Jianmin Qu
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 171-176, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-68891
https://doi.org/10.1115/IMECE2008-68891
View Paper titled, Simulation of Dynamic Fracture Along Solder-Pad Interfaces Using a Cohesive Zone Model
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Topics: Fracture (Materials), Fracture (Process), Simulation, Solders, Failure, Brittleness, Damage, Finite element methods, Solder joints
Proceedings Papers

Loading Direction Versus Crack Propagation Path in a Lead-Free Single Solder Joint Sample

Feng Gao, Jianping Jing, Janine Johnson, Frank Z. Liang, Richard L. Williams, Jianmin Qu
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 145-152, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-68099
https://doi.org/10.1115/IMECE2008-68099
View Paper titled, Loading Direction Versus Crack Propagation Path in a Lead-Free Single Solder Joint Sample
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Topics: Crack propagation, Solder joints, Solders, Alloys, Failure, Fracture (Materials), Shear (Mechanics), Fracture (Process), Intermetallic compounds
Proceedings Papers

Using High Speed Camera for Electronic Board Failure Analysis

Wade Hezeltine, Frank Z. Liang
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1193-1198, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73223
https://doi.org/10.1115/IPACK2005-73223
View Paper titled, Using High Speed Camera for Electronic Board Failure Analysis
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Topics: Failure analysis, Design, Failure, Corrective actions, Cross section (Physics), Cycles, Microscopy, Modeling, Product design, Teams
Proceedings Papers

Loading Rate Effect Investigation of Through-Hole-Mounted Solder Joints

Frank Z. Liang, Larry M. Palanuk, Mike Gabriel
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1857-1862, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73275
https://doi.org/10.1115/IPACK2005-73275
View Paper titled, Loading Rate Effect Investigation of Through-Hole-Mounted Solder Joints
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Topics: Solder joints, Shock (Mechanics), Stress, Failure, Actuators, Lead-free solders, Manufacturing
Proceedings Papers

Mechanical Shock FE Modeling for ATCA Circuit Board Design

Frank Z. Liang, Larry M. Palanuk, Wade Hezeltine
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1487-1492, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73274
https://doi.org/10.1115/IPACK2005-73274
View Paper titled, Mechanical Shock FE Modeling for ATCA Circuit Board Design
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Topics: Design, Modeling, Printed circuit boards, Shock (Mechanics), Finite element model, Bricks, Design engineering, Displacement, Displacement measurement, Dynamic response
Proceedings Papers

Electronic Board/System Nonlinearity Characterization for Dynamic Analysis

Frank Z. Liang, Wade Hezeltine, Richard L. Williams
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1493-1497, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73277
https://doi.org/10.1115/IPACK2005-73277
View Paper titled, Electronic Board/System Nonlinearity Characterization for Dynamic Analysis
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Topics: Dynamic analysis, Dynamics (Mechanics), Finite element model, Lumber, Random vibration, Shock (Mechanics), Vibration tests
eBook Chapter

Performance Analysis of an Innovative Ejector

Series: ASME Press Select Proceedings
Publisher: ASME Press
Published: 2009
ISBN: 9780791802908
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Topics: Ejectors
Proceedings Papers

FCBGA Footprints and Solder Joint Reliability

Frank Z. Liang, Rick L. Williams
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 371-375, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-60041
https://doi.org/10.1115/IMECE2004-60041
View Paper titled, FCBGA Footprints and Solder Joint Reliability
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Topics: Ball-Grid-Array packaging, Reliability, Solder joints
Proceedings Papers

Assessment of Some Integrated Cooling Mechanisms for an Active IPEM

Y. Pang, E. Scott, J. D. van Wyk, Z. Liang
Proc. ASME. IMECE2004, Heat Transfer, Volume 2, 163-170, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-59342
https://doi.org/10.1115/IMECE2004-59342
View Paper titled, Assessment of Some Integrated Cooling Mechanisms for an Active IPEM
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Topics: Cooling, Density, Electronics, Packaging, Thermal management
Proceedings Papers

Board Strain Analysis to Investigate Chassis Design Effects

Frank Z. Liang, Larry M. Palanuk, Richard L. Williams, Paresh Daharwal
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 37-44, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-80086
https://doi.org/10.1115/IMECE2005-80086
View Paper titled, Board Strain Analysis to Investigate Chassis Design Effects
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Topics: Ball-Grid-Array packaging, Design, Manufacturing, Printed circuit boards, Reliability, Risk, Strain gages
Proceedings Papers

Board Deflection/Strain Instead of Acceleration Measurements for Circuit Board FE Shock Model Validation

Frank Z. Liang, Richard L. Williams, Wade Hezeltine
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 45-50, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-80093
https://doi.org/10.1115/IMECE2005-80093
View Paper titled, Board Deflection/Strain Instead of Acceleration Measurements for Circuit Board FE Shock Model Validation
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Topics: Deflection, Model validation, Printed circuit boards, Shock (Mechanics), Reliability, Simulation, Simulation models, Stress
Journal Articles

Effects of Particle Size and Shear Rate on Melt Flow Properties During Capillary Extrusion of Glass Bead-Filled LDPE Composites

J-Z Liang
Journal: Journal of ASTM International
Publisher: ASTM International
Article Type: Research-Article
J. ASTM Int.. September 2006, 3(8): 1–7.
https://doi.org/10.1520/JAI100284
Published Online: September 1, 2006
View Article titled, Effects of Particle Size and Shear Rate on Melt Flow Properties During Capillary Extrusion of Glass Bead-Filled LDPE Composites
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Journal Articles

Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module

Y. Pang, E. Scott, J. D. van Wyk, Z. Liang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 1–8.
https://doi.org/10.1115/1.2429703
Published Online: April 16, 2006
View Article titled, Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module
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Topics: Ceramics, Cooling, Electronics, Heat, Thermal conductivity, Temperature, Thermal management
Journal Articles

Impact Fracture Behavior of Hollow Glass Bead-Filled ABS Composites

J-Z Liang
Journal: Journal of ASTM International
Publisher: ASTM International
Article Type: Research-Article
J. ASTM Int.. April 2006, 3(4): 1–7.
https://doi.org/10.1520/JAI12509
Published Online: April 1, 2006
View Article titled, Impact Fracture Behavior of Hollow Glass Bead-Filled ABS Composites
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eBook Chapter

Utilization of Recycled Polyethylene in the Preparation of Stabilized, High Performance Modified Asphalt Binders

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1993
ISBN-10: 0-8031-1881-3
ISBN: 978-0-8031-1881-2
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Journal Articles

Matrix Decomposition Methods in Experimental Modal Analysis

Z. Liang, D. J. Inman
Journal: Journal of Vibration and Acoustics
Publisher: ASME
Article Type: Technical Briefs
J. Vib. Acoust. July 1990, 112(3): 410–413.
https://doi.org/10.1115/1.2930526
Published Online: July 1, 1990
View Article titled, Matrix Decomposition Methods in Experimental Modal Analysis
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Topics: Matrix decomposition, Modal analysis