1-3 of 3
Yu-Cheng Lin
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Application of a Taguchi Method Technique in Determining the Laminating Process Parameters for a Bonding Sheet

Yu-Tang Yen, Te-Hua Fang, Yu-Cheng Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041005.
https://doi.org/10.1115/1.4002723
Published Online: November 24, 2010
View Article titled, Application of a Taguchi Method Technique in Determining the Laminating Process Parameters for a Bonding Sheet
Open the PDF for Application of a Taguchi Method Technique in Determining the Laminating Process Parameters for a Bonding Sheet in another window
Topics: Bonding, Taguchi methods, Warping, Design
Proceedings Papers

Nanoparticle-Assisted High Efficient Polymerase Chain Reaction

Yu-Cheng Lin, Hua-Lin Wu
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 181-184, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70214
https://doi.org/10.1115/MicroNano2008-70214
View Paper titled, Nanoparticle-Assisted High Efficient Polymerase Chain Reaction
Open the PDF for Nanoparticle-Assisted High Efficient Polymerase Chain Reaction in another window
Topics: Chain, Nanoparticles, Energy transformation, Innovation, Polymer chains
Journal Articles

Transient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions

Tong Hong Wang, Chang-Chi Lee, Yi-Shao Lai, Yu-Cheng Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 281–284.
https://doi.org/10.1115/1.2229229
Published Online: October 7, 2005
View Article titled, Transient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions
Open the PDF for Transient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions in another window
Topics: Boundary-value problems, Temperature, Thermal analysis, Transients (Dynamics), Vehicles, Finite element analysis, Junctions