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1-20 of 52
Y. C. Lee
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Proceedings Papers
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 11-18, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0239
Proceedings Papers
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 731-737, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23903
Proceedings Papers
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 757-762, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23907
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020802.
Paper No: EP-20-1043
Published Online: September 3, 2020
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2019, 141(1): 011005.
Paper No: EP-18-1064
Published Online: February 25, 2019
Journal Articles
Journal:
Journal of Testing and Evaluation
Publisher: ASTM International
Article Type: Research-Article
J. Test. Eval.. May 2017, 45(3): 1029–1044.
Paper No: JTE20140444
Published Online: May 24, 2017
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011003.
Paper No: EP-16-1103
Published Online: December 7, 2016
Journal Articles
Akshay Sripada, Morgan Rohlfing, Raymond Vijaendreh, Brenden Spetzler, Ramsey Abdulhamid, Aaron Porras, Y. C. Lee, Ashish Gupta, Enisa Harris
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031001.
Paper No: EP-15-1085
Published Online: May 16, 2016
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48814
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A030, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48503
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
Published Online: September 19, 2014
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. September 2014, 136(3): 030201.
Paper No: EP-14-1067
Published Online: July 24, 2014
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A005, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73290
Proceedings Papers
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A030, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17213
Proceedings Papers
Proc. ASME. ICNMM2012, ASME 2012 10th International Conference on Nanochannels, Microchannels, and Minichannels, 501-506, July 8–12, 2012
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2012-73110
Journal Articles
Ryan Lewis, M.-H. Lin, Yunda Wang, Jill Cooper, Peter Bradley, Ray Radebaugh, Marcia Huber, Y. C. Lee
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. September 2013, 5(3): 031003.
Paper No: TSEA-12-1031
Published Online: June 24, 2013
Proceedings Papers
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 181-186, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-62513
Proceedings Papers
Proc. ASME. IMECE2011, Volume 1: Advances in Aerospace Technology; Energy Water Nexus; Globalization of Engineering; Posters, 793-794, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-62792
Proceedings Papers
Ryan Lewis, M.-H. Lin, Yunda Wang, Jill Cooper, Peter Bradley, Ray Radebaugh, Marcia Huber, Y. C. Lee
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 423-428, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-63908
Proceedings Papers
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 601-606, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-64264
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