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Proceedings Papers

Assessment of the Efficacy of Learning Modules on FEM Instruction

Jacob Harnack, X. J. Xin, Liang-Wu Cai, Malcolm Panthaki
Proc. ASME. IMECE2010, Volume 6: Engineering Education and Professional Development, 451-459, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40613
https://doi.org/10.1115/IMECE2010-40613
View Paper titled, Assessment of the Efficacy of Learning Modules on FEM Instruction
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Topics: Finite element methods, Finite element model, Computer software, Construction, Engineering education, Multimedia, Undergraduate students
Proceedings Papers

Effects of Aspect Ratio and Side Constraints on Elastic Buckling of Multi Wall Structures and Tubes

Arka P. Chattopadhyay, Elizabeth Frink, Kevin Lease, X. J. Xin
Proc. ASME. MSEC2011, ASME 2011 International Manufacturing Science and Engineering Conference, Volume 2, 181-190, June 13–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2011-50048
https://doi.org/10.1115/MSEC2011-50048
View Paper titled, Effects of Aspect Ratio and Side Constraints on Elastic Buckling of Multi Wall Structures and Tubes
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Topics: Buckling, Plates (structures), Absorption, Engineering simulation, Finite element analysis, Honeycomb structures, Safety, Simulation
Proceedings Papers

Effects of Container Geometry on Energy Consumption During Hardening in Ice Cream Manufacturing

W. C. Cromer, Mark J. Miller, X. J. Xin, Z. J. Pei, Karen A. Schmidt
Proc. ASME. MSEC2010, ASME 2010 International Manufacturing Science and Engineering Conference, Volume 2, 57-62, October 12–15, 2010
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2010-34103
https://doi.org/10.1115/MSEC2010-34103
View Paper titled, Effects of Container Geometry on Energy Consumption During Hardening in Ice Cream Manufacturing
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Topics: Containers, Energy consumption, Geometry, Hardening, Ice, Manufacturing, Food products, Finite element methods, Boundary-value problems, Cooling
Proceedings Papers

A Module-Based Approach for FEM Learning in Engineering Education

X. J. Xin, Liang-Wu Cai, Bradley Yoder, Arka Chattopadhyay, Malcolm Panthaki
Proc. ASME. IMECE2009, Volume 7: Engineering Education and Professional Development, 249-256, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11516
https://doi.org/10.1115/IMECE2009-11516
View Paper titled, A Module-Based Approach for FEM Learning in Engineering Education
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Topics: Engineering education, Finite element methods, Undergraduate students, Computer software, Construction, Design, Education, Engineering disciplines, Modeling
Proceedings Papers

Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers

X. J. Xin, Z. J. Pei, Wenjie Liu
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 89-98, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39277
https://doi.org/10.1115/IMECE2002-39277
View Paper titled, Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers
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Topics: Finite element analysis, Grinding, Semiconductor wafers, Semiconductors (Materials), Wire
Journal Articles

Study on Edge Chipping in Rotary Ultrasonic Machining of Ceramics: An Integration of Designed Experiments and Finite Element Method Analysis

Yue Jiao, W. J. Liu, Z. J. Pei, X. J. Xin, C. Treadwell
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Technical Papers
J. Manuf. Sci. Eng. November 2005, 127(4): 752–758.
https://doi.org/10.1115/1.2034511
Published Online: December 26, 2004
View Article titled, Study on Edge Chipping in Rotary Ultrasonic Machining of Ceramics: An Integration of Designed Experiments and Finite Element Method Analysis
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Topics: Ceramics, Cutting, Finite element methods, Ultrasonic machining, Stress, Engineering simulation, Simulation, Drilling
Journal Articles

Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers

X. J. Xin, Z. J. Pei, Wenjie Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 177–185.
https://doi.org/10.1115/1.1649243
Published Online: July 8, 2004
View Article titled, Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers
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Topics: Grinding, Semiconductor wafers, Wire
Journal Articles

Finite Element Analysis of Die-Strength Testing Configurations for Thin Wafers

X. K. Sun, X. J. Xin, Z. J. Pei
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2005, 127(2): 189–192.
https://doi.org/10.1115/1.1869510
Published Online: May 4, 2004
View Article titled, Finite Element Analysis of Die-Strength Testing Configurations for Thin Wafers
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Topics: Finite element analysis, Semiconductor wafers, Stress, Testing, Fracture (Materials)