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Woon-Seong Kwon
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Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 131-136, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35087
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 86–90.
Published Online: June 3, 2005
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 202–207.
Published Online: July 8, 2004