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William D. Armstrong
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Proceedings Papers
Proc. ASME. IMECE96, Aerospace, 541-546, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0668
Proceedings Papers
Proc. ASME. IMECE98, Porous, Cellular and Microcellular Materials, 61-69, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0925
Proceedings Papers
Proc. ASME. IMECE2000, Adaptive Structures and Material Systems, 127-137, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1698
Proceedings Papers
Proc. ASME. IMECE2000, Adaptive Structures and Material Systems, 173-179, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1703
Proceedings Papers
Qiang Xiao, William D. Armstrong, James M. Pitarresi, Satish C. Chaparala, Brian D. Rogeman, Bahgat G. Sammakia, Luu Nguyen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1459-1470, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73239
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 208–212.
Published Online: July 8, 2004
Journal Articles
Journal:
Applied Mechanics Reviews
Publisher: ASME
Article Type: Review Articles
Appl. Mech. Rev. May 1993, 46(5): 201–210.
Published Online: May 1, 1993