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Wenjie Liu
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Proceedings Papers

Fatigue Assessment on Reverse–Balanced Flange Connections In Offshore Floating Wind Turbine Towers

Tao Zou, Wenjie Liu, Mingxin Li, Longbin Tao
Proc. ASME. OMAE2021, Volume 2: Structures, Safety, and Reliability, V002T02A023, June 21–30, 2021
Publisher: American Society of Mechanical Engineers
Paper No: OMAE2021-64973
https://doi.org/10.1115/OMAE2021-64973
View Paper titled, Fatigue Assessment on Reverse–Balanced Flange Connections In Offshore Floating Wind Turbine Towers
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Topics: Fatigue, Fatigue damage, Flange connections, Flanges, Floating wind turbines
Proceedings Papers

Modeling of Post-Combustion in an Electric Arc Furnace

Guangwu Tang, Wenjie Liu, Armin K. Silaen, Chenn Q. Zhou
Proc. ASME. IMECE2017, Volume 8: Heat Transfer and Thermal Engineering, V008T10A034, November 3–9, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2017-72493
https://doi.org/10.1115/IMECE2017-72493
View Paper titled, Modeling of Post-Combustion in an Electric Arc Furnace
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Topics: Combustion, Electric arc furnaces, Modeling, Computational fluid dynamics, Oxygen, Flow (Dynamics), Furnaces, Natural gas, Chemical energy, Eddies (Fluid dynamics)
Proceedings Papers

Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers

X. J. Xin, Z. J. Pei, Wenjie Liu
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 89-98, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39277
https://doi.org/10.1115/IMECE2002-39277
View Paper titled, Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers
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Topics: Finite element analysis, Grinding, Semiconductor wafers, Semiconductors (Materials), Wire
Journal Articles

Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers

X. J. Xin, Z. J. Pei, Wenjie Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 177–185.
https://doi.org/10.1115/1.1649243
Published Online: July 8, 2004
View Article titled, Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers
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Topics: Grinding, Semiconductor wafers, Wire