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Tzu-Chen Hung
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eBook Chapter

Performance Analysis for an Organic Rankine Cycle Using Engine Exhaust Gas as Heat Source

Series: ASME Press Select Proceedings
Publisher: ASME Press
Published: 2009
ISBN: 9780791802908
Open the PDF for Performance Analysis for an Organic Rankine Cycle Using Engine Exhaust Gas as Heat Source in another window
Topics: Engines, Exhaust systems, Heat, Organic Rankine cycle
Journal Articles

Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection

Yung-Shin Tseng, Tzu-Chen Hung, Bau-Shei Pei
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011006.
https://doi.org/10.1115/1.2837524
Published Online: January 31, 2008
View Article titled, Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection
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Topics: Computational fluid dynamics, Cooling, Heat transfer, Natural convection, Temperature, Flow (Dynamics), Thermal resistance, Computer cooling, Simulation
Journal Articles

Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber

Yen-Shu Chen, Kuo-Hsiang Chien, Chi-Chuan Wang, Tzu-Chen Hung, Yuh-Ming Ferng, Bau-Shei Pei
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 348–355.
https://doi.org/10.1115/1.2753970
Published Online: December 19, 2006
View Article titled, Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber
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Topics: Heat, Heat conduction, Plates (structures), Temperature, Temperature distribution, Thermal resistance, Vapors, Heat transfer, Flat heat pipes, Computer simulation
Journal Articles

A Numerical Study of the Enhancement of Chip Cooling via a Flow-Disturbing Obstruction Block

S. Kong Wang, Tzu-Chen Hung, Bau-Shi Pei, An-Fong Chen, Ja-Lin Du
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 523–529.
https://doi.org/10.1115/1.2070089
Published Online: May 3, 2005
View Article titled, A Numerical Study of the Enhancement of Chip Cooling via a Flow-Disturbing Obstruction Block
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Topics: Cooling, Flow (Dynamics), Fluids, Locks (Waterways), Pressure, Temperature, Vibration, Heat, Heat transfer, Convection