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Journal Articles

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Fei Qin, Qi He, Yanpeng Gong, Chuantao Hou, Hao Cheng, Tong An, Yanwei Dai, Pei Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021003.
Paper No: EP-22-1036
https://doi.org/10.1115/1.4055125
Published Online: August 18, 2022
View Article titled, An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging
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Topics: Boundary element methods, Finite element methods, Finite element model, Stiffness, Electronic packaging, Finite element analysis, Displacement, Traction
Journal Articles

Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling

Fei Qin, Shuai Zhao, Yanwei Dai, Lingyun Liu, Tong An, Pei Chen, Yanpeng Gong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031012.
Paper No: EP-21-1125
https://doi.org/10.1115/1.4053028
Published Online: December 27, 2021
View Article titled, Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling
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Topics: Cycles, Nanoindentation, Silver, Stress, Young's modulus, Stress-strain curves
Journal Articles

Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints

Tong An, Fei Qin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 011002.
Paper No: EP-15-1079
https://doi.org/10.1115/1.4032349
Published Online: March 10, 2016
View Article titled, Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints
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Topics: Failure mechanisms, Solder joints, Solders, Surface roughness, Lead-free solders, Intermetallic compounds, Tensile strength, Microcracks, Tin
Journal Articles

Analytical Solutions and a Numerical Approach for Diffusion-Induced Stresses in Intermetallic Compound Layers of Solder Joints

Tong An, Fei Qin, Guofeng Xia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011001.
Paper No: EP-13-1028
https://doi.org/10.1115/1.4025863
Published Online: November 22, 2013
View Article titled, Analytical Solutions and a Numerical Approach for Diffusion-Induced Stresses in Intermetallic Compound Layers of Solder Joints
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Topics: Diffusion (Physics), Stress, Tin, Atoms, Solders, Solder joints
Journal Articles

Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method

Guofeng Xia, Fei Qin, Cha Gao, Tong An, Wenhui Zhu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041007.
Paper No: EP-13-1018
https://doi.org/10.1115/1.4025597
Published Online: November 5, 2013
View Article titled, Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method
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Topics: Cycles, Design, Fatigue, Fatigue life, Reliability, Solder joints, Temperature, Materials properties, Stress, Taguchi methods
Journal Articles

Cracking of the Intermetallic Compound Layer in Solder Joints Under Drop Impact Loading

Tong An, Fei Qin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031004.
https://doi.org/10.1115/1.4004870
Published Online: September 14, 2011
View Article titled, Cracking of the Intermetallic Compound Layer in Solder Joints Under Drop Impact Loading
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Topics: Fracture (Materials), Fracture (Process), Solder joints, Solders, Tin, Intermetallic compounds, Failure mechanisms, Damage
Journal Articles

Strain Rate Effects and Rate-Dependent Constitutive Models of Lead-Based and Lead-Free Solders

Fei Qin, Tong An, Na Chen
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. January 2010, 77(1): 011008.
https://doi.org/10.1115/1.3168600
Published Online: September 30, 2009
View Article titled, Strain Rate Effects and Rate-Dependent Constitutive Models of Lead-Based and Lead-Free Solders
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Topics: Constitutive equations, Lead-free solders, Solder joints, Solders, Stress, Tensile strength, Stress-strain curves, Mechanical properties, Reliability, Ductility
Journal Articles

Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates

Fei Qin, Tong An, Na Chen, Jie Bai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031001.
https://doi.org/10.1115/1.3144151
Published Online: June 16, 2009
View Article titled, Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates
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Topics: Fractography, Lead-free solders, Solders, Tensile strength, Reliability, Electronic products, Solder joints, Stress-strain curves