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Journal Articles

Applying Neural Networks to the Solution of the Inverse Heat Conduction Problem in a Gun Barrel

Y. Hwang, S. Deng

J. Pressure Vessel Technol. August 2008, 130(3): 031203.

DOI: https://doi.org/10.1115/1.2937763

Published Online: June 12, 2008

View Article titled, Applying Neural Networks to the Solution of the Inverse Heat Conduction Problem in a Gun Barrel

Topics: Artificial neural networks, Gun barrels, Heat conduction, Heat flux, Temperature

Proceedings Papers

Low Temperature Wafer Bonding in Medium Vacuum

W. B. Yu, J. Wei, C. M. Tan, S. S. Deng

Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 303-307, November 13–19, 2004

Paper No: IMECE2004-60454

DOI: https://doi.org/10.1115/IMECE2004-60454

View Paper titled, Low Temperature Wafer Bonding in Medium Vacuum

Topics: Bonding, Low temperature, Semiconductor wafers, Vacuum, Plasmas (Ionized gases), Temperature, Annealing, Bubbles, Contamination, Damage

Proceedings Papers

Low Temperature Wafer Bonding Process Using Sol-Gel Intermediate Layer

S. S. Deng, J. Wei, C. M. Tan, W. B. Yu, S. M. L. Nai, C. K. Wong

Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 309-314, November 13–19, 2004

Paper No: IMECE2004-60455

DOI: https://doi.org/10.1115/IMECE2004-60455

View Paper titled, Low Temperature Wafer Bonding Process Using Sol-Gel Intermediate Layer

Topics: Bonding, Composite materials, Design, Hydrophilicity, Low temperature, Semiconductor wafers, Sol-gel processing

Proceedings Papers

Sol-Gel Coating Facilitating Si-to-Si Wafer Bonding at Low Temperature

J. Wei, S. S. Deng, C. M. Tan

Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 225-229, November 5–11, 2005

Paper No: IMECE2005-79263

DOI: https://doi.org/10.1115/IMECE2005-79263

View Paper titled, Sol-Gel Coating Facilitating Si-to-Si Wafer Bonding at Low Temperature

Topics: Bonding, Coating processes, Coatings, Low temperature, Semiconductor wafers, Sol-gel processing, Bond strength, Silicon, Temperature, Bubbles

Journal Articles

Development of an Inverse Method to Estimate Overall Building and Ventilation Parameters of Large Commercial Buildings

T. A. Reddy, S. Deng, D. E. Claridge

J. Sol. Energy Eng. February 1999, 121(1): 40–46.

DOI: https://doi.org/10.1115/1.2888141

Published Online: February 1, 1999

View Article titled, Development of an Inverse Method to Estimate Overall Building and Ventilation Parameters of Large Commercial Buildings

Topics: Structures, Ventilation, Errors, Heating and cooling, Simulation, Stress, Thermal energy

Journal citation

NARROW

Applying Neural Networks to the Solution of the Inverse Heat Conduction Problem in a Gun Barrel

Low Temperature Wafer Bonding in Medium Vacuum

Low Temperature Wafer Bonding Process Using Sol-Gel Intermediate Layer

Sol-Gel Coating Facilitating Si-to-Si Wafer Bonding at Low Temperature

Development of an Inverse Method to Estimate Overall Building and Ventilation Parameters of Large Commercial Buildings

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Applying Neural Networks to the Solution of the Inverse Heat Conduction Problem in a Gun Barrel

Low Temperature Wafer Bonding in Medium Vacuum

Low Temperature Wafer Bonding Process Using Sol-Gel Intermediate Layer

Sol-Gel Coating Facilitating Si-to-Si Wafer Bonding at Low Temperature

Development of an Inverse Method to Estimate Overall Building and Ventilation Parameters of Large Commercial Buildings

Journals

Conference Proceedings

eBooks

Resources

Opportunities

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