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Proceedings Papers

Two-Dimensional Nanoscale Heat Conduction Using Ballistic-Diffusive Equations

Ronggui Yang, Gang Chen
Proc. ASME. IMECE2001, Heat Transfer: Volume 1 — Fundamentals of Heat Transfer, 363-366, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24141
https://doi.org/10.1115/IMECE2001/HTD-24141
View Paper titled, Two-Dimensional Nanoscale Heat Conduction Using Ballistic-Diffusive Equations
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Topics: Heat conduction, Nanoscale phenomena, Relaxation (Physics), Approximation, Electromagnetic scattering, Heat, Phonons, Radiation scattering, Scattering (Physics), Size effect
Journal Articles

Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology

Li-Anne Liew, Ching-Yi Lin, Ryan Lewis, Susan Song, Qian Li, Ronggui Yang, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011003.
Paper No: EP-16-1103
https://doi.org/10.1115/1.4035241
Published Online: December 7, 2016
View Article titled, Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology
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Topics: Copper, Heat, Manufacturing, Printed circuit boards, Vapors, Water, Nylon fabrics, Condensers (steam plant), Thermal resistance
Journal Articles

Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

Dongliang Zhao, Xin Qian, Xiaokun Gu, Saad Ayub Jajja, Ronggui Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2016, 138(4): 040802.
Paper No: EP-16-1067
https://doi.org/10.1115/1.4034605
Published Online: October 6, 2016
View Article titled, Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials
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Topics: Temperature, Thermal conductivity, Thin films, Transients (Dynamics), Heat, Steady state, Sensors, Bulk solids, Thermoreflectance, Lasers
Proceedings Papers

Enhancing Flow Boiling Heat Transfer in Microchannels Using Monolithically-Coated Silicon Nanowires

Dan Li, Gensheng Wu, Wei Wang, Yunda Wang, Ronggui Yang
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 641-642, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-64922
https://doi.org/10.1115/IMECE2011-64922
View Paper titled, Enhancing Flow Boiling Heat Transfer in Microchannels Using Monolithically-Coated Silicon Nanowires
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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Nanowires, Silicon, Critical heat flux, Coating processes, Coatings, Flow instability
Proceedings Papers

Thermal Transport Across Carbon Nanotube Connected by Molecular Linkers

Jun Liu, Mohamed Alhashme, Ronggui Yang
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 395-396, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-64931
https://doi.org/10.1115/IMECE2011-64931
View Paper titled, Thermal Transport Across Carbon Nanotube Connected by Molecular Linkers
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Topics: Carbon nanotubes, Thermal conductivity, Density, Mechanical properties, Molecular dynamics
Proceedings Papers

Flat Polymer Heat Spreader With High Aspect Ratio Micro Hybrid Wick Operating Under Adverse Gravity

Christopher Oshman, Qian Li, Li-Anne Liew, Ronggui Yang, Y. C. Lee, Victor M. Bright
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 601-606, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-64264
https://doi.org/10.1115/IMECE2011-64264
View Paper titled, Flat Polymer Heat Spreader With High Aspect Ratio Micro Hybrid Wick Operating Under Adverse Gravity
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Topics: Flat heat pipes, Gravity (Force), Polymers, Copper, Thermal resistance, Columns (Structural), Heat flux, Heat transfer, Condensation, Condensers (steam plant)
Proceedings Papers

Enhanced Pool Boiling Performance on Micro-, Nano-, and Hybrid-Structured Surfaces

Qian Li, Wei Wang, Chris Oshman, Benoit Latour, Chen Li, Victor M. Bright, Yung-Cheng Lee, Ronggui Yang
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 633-640, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-64921
https://doi.org/10.1115/IMECE2011-64921
View Paper titled, Enhanced Pool Boiling Performance on Micro-, Nano-, and Hybrid-Structured Surfaces
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Topics: Columns (Structural), Critical heat flux, Heat transfer coefficients, Nanostructures , Nanowires, Pool boiling
Proceedings Papers

Frequency-Domain Thermoreflectance Technique for Measuring Thermal Conductivity and Interface Thermal Conductance of Thin Films

Jie Zhu, Dawei Tang, Wei Wang, Jun Liu, Ronggui Yang
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 371-379, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22522
https://doi.org/10.1115/IHTC14-22522
View Paper titled, Frequency-Domain Thermoreflectance Technique for Measuring Thermal Conductivity and Interface Thermal Conductance of Thin Films
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Topics: Thermal conductivity, Thermoreflectance, Thin films, Quartz, Signals, Fittings, Geometry, Heat, Metals, Nanomaterials
Proceedings Papers

Tuning Thermal Conductivity With Mechanical Strain

Xiaobo Li, Jun Liu, Ronggui Yang
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 551-558, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23334
https://doi.org/10.1115/IHTC14-23334
View Paper titled, Tuning Thermal Conductivity With Mechanical Strain
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Topics: Thermal conductivity, Carbon, Silicon, Graphene, Nanowires, Polymers, Single-walled carbon nanotubes, Thin films, Buckling, Chain
Proceedings Papers

Enhancement of Heat Transfer With Pool and Spray Impingement Boiling on Microporous and Nanowire Surface Coatings

Suraj Joottu Thiagarajan, Sreekant Narumanchi, Charles King, Wei Wang, Ronggui Yang
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 819-828, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23284
https://doi.org/10.1115/IHTC14-23284
View Paper titled, Enhancement of Heat Transfer With Pool and Spray Impingement Boiling on Microporous and Nanowire Surface Coatings
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Topics: Boiling, Coatings, Cooling, Heat transfer, Nanowires, Sprays
Proceedings Papers

Characterization of Hybrid-Wicked Copper Heat Pipe

Xianming Dai, Levey Tran, Fanghao Yang, Bo Shi, Ronggui Yang, Y. C. Lee, Chen Li
Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T30005, March 13–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: AJTEC2011-44088
https://doi.org/10.1115/AJTEC2011-44088
View Paper titled, Characterization of Hybrid-Wicked Copper Heat Pipe
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Topics: Copper, Heat pipes, Thermal conductivity, Electronics, Flat heat pipes, Heat flux, Computer cooling, Cooling, Design, Electronic packages
Proceedings Papers

Thermal Conductivity of High Contrast Nanoparticle Composites

Weixue Tian, Ronggui Yang
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 1-6, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32120
https://doi.org/10.1115/HT2007-32120
View Paper titled, Thermal Conductivity of High Contrast Nanoparticle Composites
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Topics: Composite materials, Nanoparticles, Thermal conductivity, Nanocomposites, Phonons, Percolation theory, Thermal resistance, Electromagnetic scattering, Mean free path, Particle size
Proceedings Papers

Curvature Effect on the Thermal Conductivity of Nanowires

Liang-Chun Liu, Mei-Jiau Huang, Ronggui Yang
Proc. ASME. HT2008, Heat Transfer: Volume 1, 369-372, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: HT2008-56339
https://doi.org/10.1115/HT2008-56339
View Paper titled, Curvature Effect on the Thermal Conductivity of Nanowires
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Topics: Nanowires, Thermal conductivity, Phonons, Geometry, Nanostructures , Preferences, Silicon, Wire
Proceedings Papers

Thermal Conductivity of Core-Shell Nanostructures: From Nanowires to Nanocomposites

Ronggui Yang, Gang Chen, Mildred S. Dresselhaus
Proc. ASME. HT2005, Heat Transfer: Volume 4, 895-901, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72198
https://doi.org/10.1115/HT2005-72198
View Paper titled, Thermal Conductivity of Core-Shell Nanostructures: From Nanowires to Nanocomposites
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Topics: Nanocomposites, Nanoporous materials, Nanostructures , Nanowires, Phonons, Shells, Thermal conductivity
Proceedings Papers

Monte Carlo Simulation of the Thermal Conductivity and Phonon Transport in Nanocomposites

Ming-Shan Jeng, Ronggui Yang, David Song, Gang Chen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2207-2215, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73494
https://doi.org/10.1115/IPACK2005-73494
View Paper titled, Monte Carlo Simulation of the Thermal Conductivity and Phonon Transport in Nanocomposites
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Topics: Nanocomposites, Phonons, Simulation, Thermal conductivity
Proceedings Papers

Thermal Conductivity Prediction of Periodic Nanocomposites Using Phonon Boltzmann Equation

Ronggui Yang, Gang Chen
Proc. ASME. HT-FED2004, Volume 4, 449-456, July 11–15, 2004
Publisher: American Society of Mechanical Engineers
Paper No: HT-FED2004-56460
https://doi.org/10.1115/HT-FED2004-56460
View Paper titled, Thermal Conductivity Prediction of Periodic Nanocomposites Using Phonon Boltzmann Equation
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Topics: Nanocomposites, Phonons, Superlattices, Thermal conductivity
Proceedings Papers

Pump-Probe Experimental Study of Phonon Reflectivity at an Interface and Phonon Relaxation Time

Ronggui Yang, Xiaoyuan Chen, Aaron Schmidt, Gang Chen
Proc. ASME. NANO2005, Design, Synthesis, and Applications, 55-56, September 12–14, 2005
Publisher: American Society of Mechanical Engineers
Paper No: NANO2005-87064
https://doi.org/10.1115/NANO2005-87064
View Paper titled, Pump-Probe Experimental Study of Phonon Reflectivity at an Interface and Phonon Relaxation Time
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Topics: Phonons, Probes, Pumps, Reflectance, Relaxation (Physics), Nanostructures , Electrons, Energy conversion, Engineering simulation, Heat transfer
Proceedings Papers

Nano-to-Macroscale Transport Modeling Through Approximations

Gang Chen, Ronggui Yang
Proc. ASME. IMECE2002, Heat Transfer, Volume 7, 61-68, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-32120
https://doi.org/10.1115/IMECE2002-32120
View Paper titled, Nano-to-Macroscale Transport Modeling Through Approximations
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Topics: Approximation, Diffusion (Physics), Modeling, Phonons, Heat, Thermoelectric devices, Cooling, Electron transport, Electrons, Energy conversion
Journal Articles

Modeling the Thermal Conductivity and Phonon Transport in Nanoparticle Composites Using Monte Carlo Simulation

Ming-Shan Jeng, Ronggui Yang, David Song, Gang Chen
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. April 2008, 130(4): 042410.
https://doi.org/10.1115/1.2818765
Published Online: March 19, 2008
View Article titled, Modeling the Thermal Conductivity and Phonon Transport in Nanoparticle Composites Using Monte Carlo Simulation
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Topics: Composite materials, Nanocomposites, Nanoparticles, Phonons, Simulation, Thermal conductivity, Electromagnetic scattering, Temperature, Boundary-value problems, Particulate matter
Journal Articles

Simulation of Nanoscale Multidimensional Transient Heat Conduction Problems Using Ballistic-Diffusive Equations and Phonon Boltzmann Equation

Ronggui Yang, Mem. ASME, Gang Chen, Mem. ASME, Marine Laroche, Yuan Taur
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. March 2005, 127(3): 298–306.
https://doi.org/10.1115/1.1857941
Published Online: March 24, 2005
View Article titled, Simulation of Nanoscale Multidimensional Transient Heat Conduction Problems Using Ballistic-Diffusive Equations and Phonon Boltzmann Equation
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Topics: Boundary-value problems, Heat, Nanoscale phenomena, Phonons, Temperature, Transients (Dynamics), Heat conduction, Simulation, Equilibrium (Physics), Relaxation (Physics)