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Journal Articles

In Memoriam: Professor Avram Bar-Cohen (1946–2020)

Marc Hodes, Ravi Mahajan, Zvi Ruder, Terry Simon, Karl Geisler, Michael Ohadi, Joseph Maurer, David Altman, Jim Wilson, Gennady Ziskind, Mark Spector, Ivan Catton, Vijay Dhir, Timothy Fisher, Portonovo Ayyaswamy, Boravoje Mikic
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: In Memoriam
J. Heat Mass Transfer. March 2021, 143(3): 030101.
Paper No: HT-20-1725
https://doi.org/10.1115/1.4049444
Published Online: February 2, 2021
View Article titled, In Memoriam: Professor Avram Bar-Cohen (1946–2020)
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Topics: Engineering teachers, Heat transfer, Mechanical engineering
Journal Articles

Mechanical Testing for Stretchable Electronics

Steven A. Klein, Aleksandar Aleksov, Vijay Subramanian, Pramod Malatkar, Ravi Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020905.
Paper No: EP-16-1147
https://doi.org/10.1115/1.4036389
Published Online: April 28, 2017
View Article titled, Mechanical Testing for Stretchable Electronics
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Topics: Electronics, Failure, Mechanical testing, Testing, Tension, Membranes, Reliability, Cycles
Proceedings Papers

Mechanical Testing for Stretchable Electronics

Steven A. Klein, Aleksandar Aleksov, Vijay Subramanian, Rajendra Dias, Pramod Malatkar, Ravi Mahajan
Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A033, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-68215
https://doi.org/10.1115/IMECE2016-68215
View Paper titled, Mechanical Testing for Stretchable Electronics
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Topics: Electronics, Mechanical testing, Damage, Reliability, Testing, Biomedicine, Cycles, Failure mechanisms, Muscle, Shock (Mechanics)
Proceedings Papers

Site-Specific and On-Demand High Heat-Flux Cooling Using Superlattice Based Thin-Film Thermoelectrics

Ihtesham Chowdhury, Ravi Prasher, Kelly Lofgreen, Sridhar Narasimhan, Ravi Mahajan, David Koester, Rama Venkatasubramanian
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 521-526, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89268
https://doi.org/10.1115/InterPACK2009-89268
View Paper titled, Site-Specific and On-Demand High Heat-Flux Cooling Using Superlattice Based Thin-Film Thermoelectrics
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Topics: Cooling, Heat flux, Superlattices, Thin films, Thermoelectric coolers, Thermal management, Electronic packages, Electronics, Lasers, Microscale devices
Proceedings Papers

Development of an Analytical Model to a Temperature Distribution of First Level Package With a Non-Uniformly Powered Die

Abhijit Kaisare, Dereje Agonafer, A. Haji-Sheikh, Greg Chrysler, Ravi Mahajan
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 443-449, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-43736
https://doi.org/10.1115/IMECE2007-43736
View Paper titled, Development of an Analytical Model to a Temperature Distribution of First Level Package With a Non-Uniformly Powered Die
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Topics: Temperature distribution, Heat flux, Computer simulation, Design, Flat heat pipes, Heat, Heat sinks, Junctions, Numerical analysis, Optimization
Proceedings Papers

Thermal Performance and Key Challenges for Future CPU Cooling Technologies

Ioan Sauciuc, Ravi Prasher, Je-Young Chang, Hakan Erturk, Gregory Chrysler, Chia-Pin Chiu, Ravi Mahajan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 353-364, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73242
https://doi.org/10.1115/IPACK2005-73242
View Paper titled, Thermal Performance and Key Challenges for Future CPU Cooling Technologies
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Topics: Blocks (Building materials), Boundary-value problems, Computer cooling, Cooling, Density, Design, Electrical conductivity, Heat pipes, Heat transfer, Industrial research
Proceedings Papers

Thermal Devices Integrated With Thermoelectric Modules With Applications to CPU Cooling

Ioan Sauciuc, Hakan Erturk, Gregory Chrysler, Vikram Bala, Ravi Mahajan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2153-2159, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73243
https://doi.org/10.1115/IPACK2005-73243
View Paper titled, Thermal Devices Integrated With Thermoelectric Modules With Applications to CPU Cooling
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Topics: Compressors, Computation, Computational fluid dynamics, Computer cooling, Control equipment, Cooling, Cycles, Energy consumption, Fluids, Geometry
Proceedings Papers

Thermal Based Optimization of Functional Block Distributions in a Non-Uniformly Powered Die

Abhijit Kaisare, Dereje Agonafer, A. Haji-Sheikh, Greg Chrysler, Ravi Mahajan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 675-682, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73486
https://doi.org/10.1115/IPACK2005-73486
View Paper titled, Thermal Based Optimization of Functional Block Distributions in a Non-Uniformly Powered Die
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Topics: Optimization, Design, Heat flux, Clocks, Energy dissipation, Finite element analysis, Finite element methods, Finite element model, Junctions, Separation (Technology)
Proceedings Papers

An Overview of System in Package (SiP) Applications and Technologies for CPU and Communications Systems

Lesley Polka, Ravi Mahajan, Johanna Swan, Gaurang Choksi
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 971-975, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73320
https://doi.org/10.1115/IPACK2005-73320
View Paper titled, An Overview of System in Package (SiP) Applications and Technologies for CPU and Communications Systems
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Topics: System-in-package, Architecture, Industrial research, Packaging
Journal Articles

Development of Analytical Model to a Temperature Distribution of a First Level Package With a Nonuniformly Powered Die

Abhijit Kaisare, Dereje Agonafer, A. Haji-Sheikh, Greg Chrysler, Ravi Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011005.
https://doi.org/10.1115/1.3068303
Published Online: February 12, 2009
View Article titled, Development of Analytical Model to a Temperature Distribution of a First Level Package With a Nonuniformly Powered Die
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Topics: Heat flux, Temperature, Temperature distribution, Computer simulation, Heat, Junctions, Heat sinks, Numerical analysis, Design, Optimization
Proceedings Papers

Approximate Analytical Model for a First Level Package With Non-Uniformly Powered Die

Abhijit Kaisare, Dereje Agonafer, A. Haji-Sheikh, Greg Chrysler, Ravi Mahajan
Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 43-49, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-13436
https://doi.org/10.1115/IMECE2006-13436
View Paper titled, Approximate Analytical Model for a First Level Package With Non-Uniformly Powered Die
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Topics: Clocks, Computer simulation, Design, Finite element analysis, Flat heat pipes, Heat flux, Heat sinks, Junctions, Temperature, Temperature distribution