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Raghuram V. Pucha
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Proceedings Papers

Mechanics Issues at Micro-Scale Modeling of Electronic Packages

Raghuram V. Pucha, Gnyaneshwar Ramakrishna, Suresh K. Sitaraman
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 73-82, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24709
https://doi.org/10.1115/IMECE2001/EPP-24709
View Paper titled, Mechanics Issues at Micro-Scale Modeling of Electronic Packages
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Topics: Cycles, Deformation, Electronic packages, Electronic packaging, Fatigue, Fatigue life, Materials properties, Microscale devices, Modeling, Plasticity
Proceedings Papers

Thermal Cycling Guidelines for Automotive, Computer, Portable, and Implantable Medical Device Applications

Rajiv Raghunathan, Raghuram V. Pucha, Suresh K. Sitaraman
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 51-62, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2246
https://doi.org/10.1115/IMECE2000-2246
View Paper titled, Thermal Cycling Guidelines for Automotive, Computer, Portable, and Implantable Medical Device Applications
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Topics: Computers, Medical devices, Flip-chip, Manufacturing, Automotive industry, Cycles, Damage, Density, Fatigue damage, Solders
Proceedings Papers

Study on the Choice of Constitutive and Fatigue Models in Solder Joint Life Prediction

Krishna Tunga, James Pyland, Raghuram V. Pucha, Suresh K. Sitaraman
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 329-335, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39676
https://doi.org/10.1115/IMECE2002-39676
View Paper titled, Study on the Choice of Constitutive and Fatigue Models in Solder Joint Life Prediction
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Topics: Constitutive equations, Fatigue, Solder joints, Solders, Fatigue life, Ball-Grid-Array packaging, Damage
Proceedings Papers

Enhanced Reliability of High Density Wiring (HDW) Substrates Through New Dielectric and Base Substrate Materials

Shashikant Hegde, Raghuram V. Pucha, Suresh K. Sitaraman
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 283-290, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39671
https://doi.org/10.1115/IMECE2002-39671
View Paper titled, Enhanced Reliability of High Density Wiring (HDW) Substrates Through New Dielectric and Base Substrate Materials
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Topics: Cracking (Materials), Density, Dielectric materials, Electrical wires, Fracture (Process), Reliability, Thermomechanics, Warping
Proceedings Papers

Material Interaction Effects in the Reliability of High Density Interconnect (HDI) Boards

Saketh Mahalingam, Shashikant Hegde, Gnyaneshwar Ramakrishna, Raghuram V. Pucha, Suresh K. Sitaraman
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 165-170, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41645
https://doi.org/10.1115/IMECE2003-41645
View Paper titled, Material Interaction Effects in the Reliability of High Density Interconnect (HDI) Boards
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Topics: Density, Lumber, Reliability, Cracking (Materials), Fracture (Process), Algorithms, Deformation, Design, Dielectric materials, Optimization
Journal Articles

Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment

Raghuram V. Pucha, Krishna Tunga, James Pyland, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 256–264.
https://doi.org/10.1115/1.1756150
Published Online: July 8, 2004
View Article titled, Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment
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Topics: Avionics, Creep, Cycles, Military systems, Solders, Temperature, Damage