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Proceedings Papers

Study on jet formation and penetration of double-layer sub-caliber shaped charge

Yu-ting Wang, Qiang-qiang Xiao, Zheng-xiang Huang, Xu-dong Zu, Bin Ma
Proc. ASME. HVIS2019, 2019 15th Hypervelocity Impact Symposium, V001T03A001, April 14–19, 2019
Publisher: American Society of Mechanical Engineers
Paper No: HVIS2019-100
https://doi.org/10.1115/HVIS2019-100
View Paper titled, Study on jet formation and penetration of double-layer sub-caliber shaped charge
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Topics: Engineering simulation, Explosives, Simulation
Proceedings Papers

Investigation on the Impact and Penetration Performance of the Particulated Jet into Concrete Targets

Qi-feng Zhu, Qiang-qiang Xiao, Zheng-xiang Huang, Xu-dong Zu, Xin Jia
Proc. ASME. HVIS2019, 2019 15th Hypervelocity Impact Symposium, V001T07A010, April 14–19, 2019
Publisher: American Society of Mechanical Engineers
Paper No: HVIS2019-076
https://doi.org/10.1115/HVIS2019-076
View Paper titled, Investigation on the Impact and Penetration Performance of the Particulated Jet into Concrete Targets
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Topics: Cavities, Concretes
Proceedings Papers

An Implicit Off-Design Deviation Angle Correlation of Axial Flow Compressor Blade Elements

Wu Dong-run, Teng Jin-fang, Qiang Xiao-qing, Feng Jin-zhang
Proc. ASME. GT2017, Volume 2B: Turbomachinery, V02BT41A005, June 26–30, 2017
Publisher: American Society of Mechanical Engineers
Paper No: GT2017-63189
https://doi.org/10.1115/GT2017-63189
View Paper titled, An Implicit Off-Design Deviation Angle Correlation of Axial Flow Compressor Blade Elements
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Topics: Axial flow, Blades, Design, Errors, Flow (Dynamics), Geometry, Reliability, Rotors, Statistical analysis, Stators
Proceedings Papers

Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy

Qiang Xiao, William D. Armstrong, James M. Pitarresi, Satish C. Chaparala, Brian D. Rogeman, Bahgat G. Sammakia, Luu Nguyen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1459-1470, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73239
https://doi.org/10.1115/IPACK2005-73239
View Paper titled, Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy
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Topics: Alloys, Creep, Heat, Manufacturing, Modeling, Surface mount devices, Bulk solids, Solders, Solder joints, Thermomechanics
Journal Articles

Aging Effects on Microstructure and Tensile Property of Sn3.9Ag0.6Cu Solder Alloy

Qiang Xiao, Harold J. Bailey, William D. Armstrong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 208–212.
https://doi.org/10.1115/1.1756144
Published Online: July 8, 2004
View Article titled, Aging Effects on Microstructure and Tensile Property of Sn3.9Ag0.6Cu Solder Alloy
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Topics: Alloys, Solders, Temperature, Eutectic alloys, Lead-free solders, Tin, Hardening, Tensile strength