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Proceedings Papers

Alternative Compliant Interconnects: Thermo-Mechanical Reliability, Design and Testing

Lunyu Ma, Qi Zhu, Suresh Sitaraman
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 33-42, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24704
https://doi.org/10.1115/IMECE2001/EPP-24704
View Paper titled, Alternative Compliant Interconnects: Thermo-Mechanical Reliability, Design and Testing
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Topics: Design, Reliability, Testing, Thermomechanics, Springs, Density, Electronic packages, Integrated circuit fabrication, Manufacturing, Packaging
Proceedings Papers

Effects of the Manufacturing Process on the Dimensional Accuracy of Thermoset Composites

Qi Zhu, Philippe H. Geubelle
Proc. ASME. IMECE2000, Heat Transfer: Volume 3, 319-328, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1490
https://doi.org/10.1115/IMECE2000-1490
View Paper titled, Effects of the Manufacturing Process on the Dimensional Accuracy of Thermoset Composites
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Topics: Manufacturing, Thermosetting composites, Composite materials, Residual stresses, Hardening (Curing), Stress, Cycles, Deformation, Design, Epoxy adhesives
Proceedings Papers

Metocean Design Criteria Considerations in South China Sea by Adopting Multivariate Extreme Value Theory

Ping Li, Qi Zhu, Chunqi Zhou, Linbin Li, Hongtao Li
Proc. ASME. OMAE2017, Volume 1: Offshore Technology, V001T01A028, June 25–30, 2017
Publisher: American Society of Mechanical Engineers
Paper No: OMAE2017-62541
https://doi.org/10.1115/OMAE2017-62541
View Paper titled, Metocean Design Criteria Considerations in South China Sea by Adopting Multivariate Extreme Value Theory
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Topics: China, Design, Seas, Significant wave heights, Statistical distributions, Surges, Tides, Wind velocity, Modeling, Offshore structures
Proceedings Papers

Study of Electroplated Compliant G-Helix Chip-to-Substrate Interconnects

Qi Zhu, Lunyu Ma, Suresh K. Sitaraman
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 875-886, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35342
https://doi.org/10.1115/IPACK2003-35342
View Paper titled, Study of Electroplated Compliant G-Helix Chip-to-Substrate Interconnects
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Topics: Diluents, Displacement, Electroplating, Geometry, Integrated circuit fabrication, Manufacturing, Microelectromechanical systems, Optimization, Packaging, Photolithography
Proceedings Papers

A Lithography-Based Compliant Chip-to-Substrate Wafer-Level Interconnect

Qi Zhu, Lunyu Ma, Suresh K. Sitaraman
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 353-359, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39679
https://doi.org/10.1115/IMECE2002-39679
View Paper titled, A Lithography-Based Compliant Chip-to-Substrate Wafer-Level Interconnect
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Topics: Lithography, Semiconductor wafers, Packaging, Design, Manufacturing, Diluents, Displacement, Electronic packaging, Geometry, Integrated circuit fabrication
Proceedings Papers

Mechanical and Electrical Study of Linear Spring and J-Spring

Lunyu Ma, Qi Zhu, Suresh K. Sitaraman
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 387-394, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39683
https://doi.org/10.1115/IMECE2002-39683
View Paper titled, Mechanical and Electrical Study of Linear Spring and J-Spring
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Topics: Springs, Semiconductor wafers, Semiconductors (Materials), Computer simulation, Geometry, Manufacturing, Stress, Density, Dimensions, Displacement
Proceedings Papers

Three-Mask Fabrication and Optimized Design of First-Level Free-Standing Interconnect for Microelectronics Application

Qi Zhu, Lunyu Ma, George Lo, Suresh K. Sitaraman
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 171-182, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41833
https://doi.org/10.1115/IMECE2003-41833
View Paper titled, Three-Mask Fabrication and Optimized Design of First-Level Free-Standing Interconnect for Microelectronics Application
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Topics: Design, Manufacturing, Microelectronic devices, Cycles, Heat sinks, Lead-free solders, Optimization, Packaging, Printed circuit boards, Reliability
Proceedings Papers

Contact Reliability of Innovative Compliant Interconnects for Next Generation Electronic Packaging

Lunyu Ma, Qi Zhu, Suresh K. Sitaraman
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 9-17, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41753
https://doi.org/10.1115/IMECE2003-41753
View Paper titled, Contact Reliability of Innovative Compliant Interconnects for Next Generation Electronic Packaging
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Topics: Electronic packaging, Reliability, Stress
Journal Articles

Development of G-Helix Structure as Off-Chip Interconnect

Qi Zhu, Lunyu Ma, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 237–246.
https://doi.org/10.1115/1.1756148
Published Online: July 8, 2004
View Article titled, Development of G-Helix Structure as Off-Chip Interconnect
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Topics: Design, Displacement, Geometry, Manufacturing, Optimization, Packaging, Reliability, Solders, Stress, Thermomechanics