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Prabjit Singh
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Journal Articles
Satyam Saini, Jimil M. Shah, Pardeep Shahi, Pratik Bansode, Dereje Agonafer, Prabjit Singh, Roger Schmidt, Mike Kaler
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2022, 144(3): 030801.
Paper No: EP-20-1054
Published Online: September 15, 2021
Journal Articles
Jimil M. Shah, Roshan Anand, Prabjit Singh, Satyam Saini, Rawhan Cyriac, Dereje Agonafer, Mike Kaler
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041103.
Paper No: EP-19-1096
Published Online: June 23, 2020
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2020, 142(2): 024501.
Paper No: EP-19-1015
Published Online: April 6, 2020
Proceedings Papers
Jimil M. Shah, Roshan Anand, Satyam Saini, Rawhan Cyriac, Dereje Agonafer, Prabjit Singh, Mike Kaler
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A016, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6601
Journal Articles
Jimil M. Shah, Oluwaseun Awe, Betsegaw Gebrehiwot, Dereje Agonafer, Prabjit Singh, Naveen Kannan, Mike Kaler
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020903.
Paper No: EP-16-1143
Published Online: April 24, 2017
Proceedings Papers
Jimil M. Shah, Oluwaseun Awe, Pavan Agarwal, Iziren Akhigbe, Dereje Agonafer, Prabjit Singh, Naveen Kannan, Mike Kaler
Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A052, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-66199
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48154
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A019, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48349
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48176
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A011, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48180