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Paul T. Vianco
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Journal Articles

Gold-Tin Solder Wetting Behavior for Package Lid Seals

Paul T. Vianco, Alice C. Kilgo, Bonnie M. McKenzie
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021003.
Paper No: EP-17-1115
https://doi.org/10.1115/1.4039749
Published Online: May 9, 2018
View Article titled, Gold-Tin Solder Wetting Behavior for Package Lid Seals
Open the PDF for Gold-Tin Solder Wetting Behavior for Package Lid Seals in another window
Topics: Solders, Tin, Ceramics, Wetting, Contamination, Solder joints
Journal Articles

UCPD Model for Pb-Free Solder

Michael K. Neilsen, Paul T. Vianco
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041006.
Paper No: EP-13-1101
https://doi.org/10.1115/1.4026851
Published Online: September 19, 2014
View Article titled, UCPD Model for Pb-Free Solder
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Topics: Cycles, Damage, Fracture (Materials), Lead-free solders, Solder joints, Solders, Failure, Fatigue, Simulation
Journal Articles

A General Methodology to Predict Fatigue Life in Lead-Free Solder Alloy Interconnects

David M. Pierce, Sheri D. Sheppard, Paul T. Vianco
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011008.
https://doi.org/10.1115/1.3068313
Published Online: February 13, 2009
View Article titled, A General Methodology to Predict Fatigue Life in Lead-Free Solder Alloy Interconnects
Open the PDF for A General Methodology to Predict Fatigue Life in Lead-Free Solder Alloy Interconnects in another window
Topics: Alloys, Cycles, Dynamic light scattering, Fatigue, Fatigue life, Finite element analysis, Fracture (Materials), Lead-free solders, Simulation, Solders
Journal Articles

Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn–3.9Ag–0.6Cu Lead-Free Solder

David M. Pierce, Sheri D. Sheppard, Arlo F. Fossum, Paul T. Vianco, Mike K. Neilsen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011002.
https://doi.org/10.1115/1.2837513
Published Online: January 31, 2008
View Article titled, Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn–3.9Ag–0.6Cu Lead-Free Solder
Open the PDF for Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn–3.9Ag–0.6Cu Lead-Free Solder in another window
Topics: Constitutive equations, Creep, Damage, Finite element analysis, Plasticity, Simulation, Solders, Temperature, Stress, Fatigue
Journal Articles

Validation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects

David M. Pierce, Sheri D. Sheppard, Paul T. Vianco, Jerome A. Regent, J. Mark Grazier
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011003.
https://doi.org/10.1115/1.2837515
Published Online: January 31, 2008
View Article titled, Validation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects
Open the PDF for Validation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects in another window
Topics: Ball-Grid-Array packaging, Cycles, Fatigue cracks, Fatigue life, Finite element analysis, Fracture (Materials), Manufacturing, Solder joints, Solders, Lead-free solders