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Matthew M. F. Yuen
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Proceedings Papers

Two-Dimensional Trimmed Surface Development Using a Physics-Based Model

Charlie C. L. Wang, Shiang-Fong Chen, Jin Fan, Matthew M. F. Yuen
Proc. ASME. DETC99, Volume 1: 25th Design Automation Conference, 641-647, September 12–16, 1999
Publisher: American Society of Mechanical Engineers
Paper No: DETC99/DAC-8634
https://doi.org/10.1115/DETC99/DAC-8634
View Paper titled, Two-Dimensional Trimmed Surface Development Using a Physics-Based Model
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Topics: Computer-aided design, Cutting, Deformation, Physics, Shipbuilding, Springs, Texture (Materials), Topology
Proceedings Papers

“Thin” vs. “Fat” Client of Web-Based CAD Tools

Charlie C. L. Wang, Matthew M. F. Yuen, Yu Wang
Proc. ASME. IDETC-CIE2000, Volume 1: 20th Computers and Information in Engineering Conference, 577-582, September 10–13, 2000
Publisher: American Society of Mechanical Engineers
Paper No: DETC2000/CIE-14638
https://doi.org/10.1115/DETC2000/CIE-14638
View Paper titled, “Thin” vs. “Fat” Client of Web-Based CAD Tools
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Topics: Computer-aided design
Proceedings Papers

Fluid Simulation on the World Wide Web: Transient Natural Convection in a Cavity

Charlie C. L. Wang, Matthew M. F. Yuen, Yu Wang
Proc. ASME. IDETC-CIE2000, Volume 2: 26th Design Automation Conference, 825-830, September 10–13, 2000
Publisher: American Society of Mechanical Engineers
Paper No: DETC2000/DAC-14522
https://doi.org/10.1115/DETC2000/DAC-14522
View Paper titled, Fluid Simulation on the World Wide Web: Transient Natural Convection in a Cavity
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Topics: Cavities, Fluids, Natural convection, Simulation, Transients (Dynamics), Computer-aided engineering, Internet, Computational fluid dynamics, Computer software, Computer-aided design
Proceedings Papers

View-Dependent Deformation With Sketching Input

Charlie C. L. Wang, Matthew M. F. Yuen
Proc. ASME. IDETC-CIE2001, Volume 2B: 27th Design Automation Conference, 1209-1214, September 9–12, 2001
Publisher: American Society of Mechanical Engineers
Paper No: DETC2001/DAC-21142
https://doi.org/10.1115/DETC2001/DAC-21142
View Paper titled, View-Dependent Deformation With Sketching Input
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Topics: Deformation, Geometric modeling
Proceedings Papers

Sketch Based Mesh Extrusion With Remeshing Techniques

Charlie C. L. Wang, Matthew M. F. Yuen
Proc. ASME. IDETC-CIE2001, Volume 1: 21st Computers and Information in Engineering Conference, 731-738, September 9–12, 2001
Publisher: American Society of Mechanical Engineers
Paper No: DETC2001/CIE-21305
https://doi.org/10.1115/DETC2001/CIE-21305
View Paper titled, Sketch Based Mesh Extrusion With Remeshing Techniques
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Topics: Extruding, Geometric modeling, Optimization
Proceedings Papers

Remeshing Based Mesh Smoothing by 2D Sketches Input

Charlie C. L. Wang, Yu Wang, Matthew M. F. Yuen
Proc. ASME. IDETC-CIE2002, Volume 1: 22nd Computers and Information in Engineering Conference, 579-587, September 29–October 2, 2002
Publisher: American Society of Mechanical Engineers
Paper No: DETC2002/CIE-34478
https://doi.org/10.1115/DETC2002/CIE-34478
View Paper titled, Remeshing Based Mesh Smoothing by 2D Sketches Input
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Topics: Cavities, Design, Geometric modeling, Membranes, Smoothing methods, Topology
Proceedings Papers

3D “Micro’’-Geometry Modeling From Image Cues

Yu Wang, Charlie C. L. Wang, Matthew M. F. Yuen
Proc. ASME. IDETC-CIE2002, Volume 1: 22nd Computers and Information in Engineering Conference, 589-596, September 29–October 2, 2002
Publisher: American Society of Mechanical Engineers
Paper No: DETC2002/CIE-34479
https://doi.org/10.1115/DETC2002/CIE-34479
View Paper titled, 3D “Micro’’-Geometry Modeling From Image Cues
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Topics: Geometry, Modeling, Algorithms, Image segmentation, Shades and shadows, Computer-aided design, Construction, Geometric modeling, Shapes
Proceedings Papers

Passive Alignment of Optical Fiber in a V-Groove With Low Viscosity Epoxy Flow

Jeffery C. C. Lo, C. S. Yung, S. W. Ricky Lee, Steve H. K. Lee, J. S. Wu, Matthew M. F. Yuen
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 403-406, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-43902
https://doi.org/10.1115/IMECE2003-43902
View Paper titled, Passive Alignment of Optical Fiber in a V-Groove With Low Viscosity Epoxy Flow
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Topics: Epoxy adhesives, Epoxy resins, Flow (Dynamics), Optical fiber, Viscosity, Canals, Fibers, Geometry, Manufacturing, Packaging
Journal Articles

Molecular Dynamics Simulation of Thermal Cycling Test in Electronic Packaging

Hai Bo Fan, Edward K. L. Chan, Cell K. Y. Wong, Matthew M. F. Yuen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 35–40.
https://doi.org/10.1115/1.2429707
Published Online: March 14, 2006
View Article titled, Molecular Dynamics Simulation of Thermal Cycling Test in Electronic Packaging
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Topics: Adhesion, Electronic packaging, Molecular dynamics simulation, Reliability, Epoxy resins, Simulation, Cycles, Copper, Molecular dynamics
Journal Articles

Warpage of Plastic IC Packages as a Function of Processing Conditions

Dickson T. S. Yeung, Matthew M. F. Yuen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 268–272.
https://doi.org/10.1115/1.1349421
Published Online: December 22, 1999
View Article titled, Warpage of Plastic IC Packages as a Function of Processing Conditions
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Topics: Molding, Warping, Finite element analysis, Temperature, Shear modulus, Thermal expansion, Glass transition, Thermal characterization
Journal Articles

Specimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages

Dickson T. S. Yeung, David C. C. Lam, Matthew M. F. Yuen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 67–72.
https://doi.org/10.1115/1.483137
Published Online: December 9, 1999
View Article titled, Specimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages
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Topics: Design, Electronic packages, Electronic packaging, Fracture (Materials), Fracture (Process), Fracture toughness, Stress, Testing, Geometry, Packaging