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1-11 of 11
M. Baris Dogruoz
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021004.
Paper No: EP-16-1035
Published Online: April 19, 2016
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A002, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73031
Proceedings Papers
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T23A008, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17833
Proceedings Papers
Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 1515-1522, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-89857
Proceedings Papers
Proc. ASME. IMECE2011, Volume 6: Fluids and Thermal Systems; Advances for Process Industries, Parts A and B, 1381-1388, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-65626
Proceedings Papers
Proc. ASME. IMECE2011, Volume 6: Fluids and Thermal Systems; Advances for Process Industries, Parts A and B, 1389-1395, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-65628
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 259-267, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52172
Journal Articles
Publisher: ASME
Article Type: Invited Papers
J. Thermal Sci. Eng. Appl. June 2009, 1(2): 022003.
Published Online: November 12, 2009
Proceedings Papers
Proc. ASME. IMECE2002, Heat Transfer, Volume 7, 195-206, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39245
Proceedings Papers
Proc. ASME. IMECE2003, Heat Transfer, Volume 4, 397-404, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-43347
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 53–60.
Published Online: July 30, 2005