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Proceedings Papers

A Drive-Through Passenger Vehicle Inspecting System Using X-Ray Digital Radiography

Jianmin Tong, Yibin Huang, Xiaojing Guo, Liu Chen, Peng Cong, Zhentao Wang, Guilai Xing, Liqiang Wang
Proc. ASME. ICONE29, Volume 5: Nuclear Safety, Security, and Cyber Security, V005T05A067, August 8–12, 2022
Publisher: American Society of Mechanical Engineers
Paper No: ICONE29-93780
https://doi.org/10.1115/ICONE29-93780
View Paper titled, A Drive-Through Passenger Vehicle Inspecting System Using X-Ray Digital Radiography
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Topics: Vehicles, X-rays
Proceedings Papers

Sensitivity Analysis of Impeller Blade Parameters to Compressor Performance and Aerodynamic Noise

Cao Yipeng, Ma Zequn, Liu Chen
Proc. ASME. GT2022, Volume 7: Industrial and Cogeneration; Manufacturing Materials and Metallurgy; Microturbines, Turbochargers, and Small Turbomachines; Oil & Gas Applications, V007T18A010, June 13–17, 2022
Publisher: American Society of Mechanical Engineers
Paper No: GT2022-81705
https://doi.org/10.1115/GT2022-81705
View Paper titled, Sensitivity Analysis of Impeller Blade Parameters to Compressor Performance and Aerodynamic Noise
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Topics: Aerodynamic noise, Blades, Compressors, Impellers, Sensitivity analysis
Proceedings Papers

Effect of the Diffuser on Diesel Turbocharger Compressor Performance and Noise Emission

Liu Chen, Cao Yipeng, Zhang Wenping
Proc. ASME. ICEF2017, Volume 2: Emissions Control Systems; Instrumentation, Controls, and Hybrids; Numerical Simulation; Engine Design and Mechanical Development, V002T07A010, October 15–18, 2017
Publisher: American Society of Mechanical Engineers
Paper No: ICEF2017-3562
https://doi.org/10.1115/ICEF2017-3562
View Paper titled, Effect of the Diffuser on Diesel Turbocharger Compressor Performance and Noise Emission
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Topics: Compressors, Diesel, Diffusers, Emissions, Noise (Sound), Turbochargers, Blades, Impellers, Flow (Dynamics), Pinch effect
Proceedings Papers

Study on the Simulation Method of Compressor Aerodynamic Noise Based on CFD and IBEM

Liu Chen, Cao Yipeng, Sun Wenjian, Zhang Wenping, Ming Pingjian, Lin Guang
Proc. ASME. ICEF2016, ASME 2016 Internal Combustion Engine Division Fall Technical Conference, V001T07A004, October 9–12, 2016
Publisher: American Society of Mechanical Engineers
Paper No: ICEF2016-9420
https://doi.org/10.1115/ICEF2016-9420
View Paper titled, Study on the Simulation Method of Compressor Aerodynamic Noise Based on CFD and IBEM
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Topics: Aerodynamic noise, Compressors, Computational fluid dynamics, Simulation, Noise (Sound), Turbochargers, Blades, Boundary element methods, Radiation (Physics), Acoustics
Journal Articles

Characterization of Substrate Materials for System-in-a-Package Applications

Liu Chen, Anders S. G. Andræ, Gang Zou, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 195–201.
https://doi.org/10.1115/1.1648057
Published Online: July 8, 2004
View Article titled, Characterization of Substrate Materials for System-in-a-Package Applications
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Topics: Ceramics, Cooling, Density, Epoxy resins, Finite element methods, Manufacturing, Microwaves, Reliability, System-in-package, Thermal expansion
Journal Articles

Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies

Xia Cai, Liu Chen, Qun Zhang, Bulu Xu, Weidong Huang, Xiaoming Xie, Zhaonian Cheng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 84–92.
https://doi.org/10.1115/1.1533802
Published Online: March 14, 2003
View Article titled, Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies
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Topics: Finite element analysis, Flip-chip assemblies, Simulation, Solder joints, Solders, Stress, Deformation, Cycles, Flip-chip packages, Thermal expansion