1-5 of 5
Leila Jannesari Ladani
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Effect of Design Variables on Voids and Thermal Performance of QFN Packages

Farbod Askari, Leila Jannesari Ladani, Abhijit Dasgupta, Matti Rahko, Jussi Sarkka
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 705-712, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32067
https://doi.org/10.1115/HT2007-32067
View Paper titled, Effect of Design Variables on Voids and Thermal Performance of QFN Packages
Open the PDF for Effect of Design Variables on Voids and Thermal Performance of QFN Packages in another window
Topics: Design, Finite element analysis, Solders
Proceedings Papers

Effect of Voids on Thermo-Mechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation

Leila Jannesari Ladani, Abhijit Dasgupta
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 57-63, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-80238
https://doi.org/10.1115/IMECE2005-80238
View Paper titled, Effect of Voids on Thermo-Mechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation
Open the PDF for Effect of Voids on Thermo-Mechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation in another window
Topics: Ball-Grid-Array packaging, Durability, Finite element analysis, Modeling, Simulation, Solder joints, Thermomechanics
Journal Articles

Damage Initiation and Propagation in Voided Joints: Modeling and Experiment

Leila Jannesari Ladani, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011008.
https://doi.org/10.1115/1.2837562
Published Online: February 4, 2008
View Article titled, Damage Initiation and Propagation in Voided Joints: Modeling and Experiment
Open the PDF for Damage Initiation and Propagation in Voided Joints: Modeling and Experiment in another window
Topics: Damage, Finite element analysis, Modeling, Solders, Durability, Solder joints, Creep
Proceedings Papers

Effect of Selected Manufacturing Variables on Reliability of Lead Free Solder Joints

Leila Jannesari Ladani, Abhijit Dasgupta, Idelcio Cardoso, Eduardo Monlevade
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 109-116, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-13963
https://doi.org/10.1115/IMECE2006-13963
View Paper titled, Effect of Selected Manufacturing Variables on Reliability of Lead Free Solder Joints
Open the PDF for Effect of Selected Manufacturing Variables on Reliability of Lead Free Solder Joints in another window
Topics: Lead-free solders, Manufacturing, Reliability, Durability, Errors, Heating, Solder joints, Cooling, Experimental design, Intermetallic compounds
Journal Articles

Effect of Voids on Thermomechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation

Leila Jannesari Ladani, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 273–277.
https://doi.org/10.1115/1.2753911
Published Online: September 8, 2006
View Article titled, Effect of Voids on Thermomechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation
Open the PDF for Effect of Voids on Thermomechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation in another window
Topics: Ball-Grid-Array packaging, Creep, Damage, Durability, Finite element analysis, Modeling, Solders, Thermomechanics, Reliability, Solder joints