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Leila J. Ladani
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Proceedings Papers

Thermo-Mechanical Reliability of Through Silicon Vias (TSVs) and Solder Interconnects in 3-Dimensional Integrated Circuits

Leila J. Ladani, Omar Rodriguez
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 27-32, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89056
https://doi.org/10.1115/InterPACK2009-89056
View Paper titled, Thermo-Mechanical Reliability of Through Silicon Vias (TSVs) and Solder Interconnects in 3-Dimensional Integrated Circuits
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Topics: Integrated circuits, Reliability, Silicon, Solders, Thermomechanics, Design, Durability, Solder joints, Copper, Cycles
Proceedings Papers

Effect of Design Parameters on Thermo-Mechanical Stresses in 3D ICS

Leila J. Ladani
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 711-715, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89083
https://doi.org/10.1115/InterPACK2009-89083
View Paper titled, Effect of Design Parameters on Thermo-Mechanical Stresses in 3D ICS
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Topics: Design, Stress, Thermomechanics, Copper, Finite element analysis, Stiffness, Density, Diffusion (Physics), Finite element model, Integrated circuits
Journal Articles

Successive Softening and Cyclic Damage in Viscoplastic Material

Leila J. Ladani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041011.
https://doi.org/10.1115/1.4002722
Published Online: December 8, 2010
View Article titled, Successive Softening and Cyclic Damage in Viscoplastic Material
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Topics: Damage, Solders, Modeling, Finite element analysis, Cycles
Proceedings Papers

Bonding Strength and Microstructure of SnAg-Based Solid Liquid Inter-Diffusion Bonds

Leila J. Ladani, Jafar Razmi
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 107-111, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11454
https://doi.org/10.1115/IMECE2009-11454
View Paper titled, Bonding Strength and Microstructure of SnAg-Based Solid Liquid Inter-Diffusion Bonds
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Topics: Bonding, Diffusion (Physics), Intermetallic compounds
Proceedings Papers

Interaction Effect of Voids and Standoff Height on Thermo-Mechanical Durability of BGA Solder Joints

Leila J. Ladani, Jafar Razmi
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 113-120, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11471
https://doi.org/10.1115/IMECE2009-11471
View Paper titled, Interaction Effect of Voids and Standoff Height on Thermo-Mechanical Durability of BGA Solder Joints
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Topics: Ball-Grid-Array packaging, Durability, Solder joints, Thermomechanics
Proceedings Papers

A Mechanical Fatigue Damage Evolution Model for PB-Free Solder Materials

Leila J. Ladani, Jafar Razmi
Proc. ASME. IMECE2008, Volume 13: Nano-Manufacturing Technology; and Micro and Nano Systems, Parts A and B, 603-609, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-68100
https://doi.org/10.1115/IMECE2008-68100
View Paper titled, A Mechanical Fatigue Damage Evolution Model for PB-Free Solder Materials
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Topics: Fatigue, Fatigue damage, Lead-free solders, Damage, Anisotropy, Creep, Damage mechanics, Microelectronic devices, Micromechanics (Engineering), Plasticity
Proceedings Papers

Partitioned Cyclic Fatigue Damage Evolution Model for PB-Free Solder Materials

Leila J. Ladani, A. Dasgupta
Proc. ASME. PVP2007, Volume 9: Eighth International Conference on Creep and Fatigue at Elevated Temperatures, 119-125, July 22–26, 2007
Publisher: American Society of Mechanical Engineers
Paper No: CREEP2007-26306
https://doi.org/10.1115/CREEP2007-26306
View Paper titled, Partitioned Cyclic Fatigue Damage Evolution Model for PB-Free Solder Materials
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Topics: Constitutive equations, Damage, Fatigue damage, Lead-free solders, Stress, Creep, Deformation, Dislocations, Microscale devices, Diffusion (Physics)