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Proceedings Papers

Electropulsing-Assisted Ultrasonic Nanocrystal Surface Modification on Microstructures and Mechanical Properties of Additive Manufactured Inconel 718

Chaoyi Zhang, Le Gao, Lan Peng, Gang Liu, Yixuan Ye, Yu Zhang, Chao Tang, Tao Huang, Chang Ye
Proc. ASME. MSEC2023, Volume 2: Manufacturing Equipment and Automation; Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability, V002T06A039, June 12–16, 2023
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2023-106010
https://doi.org/10.1115/MSEC2023-106010
View Paper titled, Electropulsing-Assisted Ultrasonic Nanocrystal Surface Modification on Microstructures and Mechanical Properties of Additive Manufactured Inconel 718
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Topics: Additive manufacturing, Mechanical properties, Nanocrystals, Porosity, Residual stresses
Proceedings Papers

Experimental Investigation of Cable Arrangement on the Cable Burning Behavior in a Cone Calorimeter

Ping Yang, Xianjia Huang, Lan Peng, Chaoliang Xing, Chunyang Zhao
Proc. ASME. ICONE29, Volume 5: Nuclear Safety, Security, and Cyber Security, V005T05A033, August 8–12, 2022
Publisher: American Society of Mechanical Engineers
Paper No: ICONE29-92145
https://doi.org/10.1115/ICONE29-92145
View Paper titled, Experimental Investigation of Cable Arrangement on the Cable Burning Behavior in a Cone Calorimeter
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Topics: Cables, Combustion
Proceedings Papers

A Modified Two-Zone Model for Predicting Heat Release Rate of Pool Fire in a Confined Space

Lan Peng, Xianjia Huang, Jinkai Wang, He Zhu, Ping Yang, Chaoliang Xing, Chunyang Zhao
Proc. ASME. ICONE29, Volume 5: Nuclear Safety, Security, and Cyber Security, V005T05A042, August 8–12, 2022
Publisher: American Society of Mechanical Engineers
Paper No: ICONE29-92422
https://doi.org/10.1115/ICONE29-92422
View Paper titled, A Modified Two-Zone Model for Predicting Heat Release Rate of Pool Fire in a Confined Space
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Topics: Heat, Liquid pool fires, Oxygen
Journal Articles

Edge Trimming Induced Defects on Direct Bonded Wafers

Fumihiro Inoue, Anne Jourdain, Lan Peng, Alain Phommahaxay, Daisuke Kosemura, Ingrid De Wolf, Kenneth June Rebibis, Andy Miller, Erik Sleeckx, Eric Beyne
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031004.
Paper No: EP-17-1127
https://doi.org/10.1115/1.4040002
Published Online: May 11, 2018
View Article titled, Edge Trimming Induced Defects on Direct Bonded Wafers
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Topics: Damage, Grinding, Semiconductor wafers, Stress, Bonding
Proceedings Papers

A Method Evaluating Fire Hazard of Multiple-Layer Cable Tray and its Validation

Xianjia Huang, Kun Bi, Jun Xiao, Lan Peng, He Zhu, Zihui Zheng
Proc. ASME. ICONE25, Volume 4: Nuclear Safety, Security, Non-Proliferation and Cyber Security; Risk Management, V004T06A001, July 2–6, 2017
Publisher: American Society of Mechanical Engineers
Paper No: ICONE25-66017
https://doi.org/10.1115/ICONE25-66017
View Paper titled, A Method Evaluating Fire Hazard of Multiple-Layer Cable Tray and its Validation
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Topics: Cables, Fire, Hazards, Combustion, Heat, Simulation, Temperature, Dynamics (Mechanics), Flames, Temperature profiles
Journal Articles

Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding

Herman Oprins, Vladimir Cherman, Tomas Webers, Abdellah Salahouelhadj, Soon-Wook Kim, Lan Peng, Geert Van der Plas, Eric Beyne
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011008.
Paper No: EP-16-1096
https://doi.org/10.1115/1.4035597
Published Online: January 10, 2017
View Article titled, Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding
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Topics: Bonding, Semiconductor wafers, Thermal resistance, Transients (Dynamics), Temperature, Steady state
Proceedings Papers

Numerical Simulation of Thermocapillary-Buoyancy Convection in Encapsulated Liquid Column With Deformable Interfaces

Lan Peng, Juan-Fang Liu, You-Rong Li, Yan Wang
Proc. ASME. ICNMM2009, ASME 2009 7th International Conference on Nanochannels, Microchannels and Minichannels, 1031-1036, June 22–24, 2009
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2009-82160
https://doi.org/10.1115/ICNMM2009-82160
View Paper titled, Numerical Simulation of Thermocapillary-Buoyancy Convection in Encapsulated Liquid Column With Deformable Interfaces
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Topics: Buoyancy, Computer simulation, Convection, Bridges (Structures), Deformation, Finite volume methods, Fluids, Runge-Kutta methods, Temperature
Proceedings Papers

Numerical Simulation of Self-Induced Thermocapillary Flow for Non-Uniform Evaporating Meniscus in Capillary Tubes

You-Rong Li, Bo Lan, Lan Peng, Ying-Jie Liu
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 989-994, January 10–13, 2007
Publisher: American Society of Mechanical Engineers
Paper No: MNC2007-21147
https://doi.org/10.1115/MNC2007-21147
View Paper titled, Numerical Simulation of Self-Induced Thermocapillary Flow for Non-Uniform Evaporating Meniscus in Capillary Tubes
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Topics: Computer simulation, Convection, Evaporation, Flow (Dynamics)
Proceedings Papers

Three-Dimensional Flow of Silicon Melt in a Rotating Shallow Annular Pool

You-Rong Li, Lan Peng, Shuang-Ying Wu, Dan-Ling Zeng, Nobuyuki Imaishi
Proc. ASME. IMECE2004, Heat Transfer, Volume 3, 491-497, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-60640
https://doi.org/10.1115/IMECE2004-60640
View Paper titled, Three-Dimensional Flow of Silicon Melt in a Rotating Shallow Annular Pool
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Topics: Computer simulation, Flow (Dynamics), Silicon
Proceedings Papers

A Numerical Study of Effect of Liquid Encapsulation on Thermocapillary Convection in Liquid Bridge

Lan Peng, Dan-Ling Zeng, You-Rong Li
Proc. ASME. IMECE2004, Heat Transfer, Volume 3, 507-511, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-60770
https://doi.org/10.1115/IMECE2004-60770
View Paper titled, A Numerical Study of Effect of Liquid Encapsulation on Thermocapillary Convection in Liquid Bridge
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Topics: Bridges (Structures), Convection
Proceedings Papers

Entropy Generation in Natural Convection of Water Near Its Density Maximum in a Square Cavity

You-Rong Li, Nu-Bo Deng, Shuang-Ying Wu, Lan Peng, Dan-Ling Zeng
Proc. ASME. IMECE2004, Advanced Energy Systems, 215-221, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-61090
https://doi.org/10.1115/IMECE2004-61090
View Paper titled, Entropy Generation in Natural Convection of Water Near Its Density Maximum in a Square Cavity
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Topics: Cavities, Density, Entropy, Natural convection, Water
Proceedings Papers

Numerical Simulation of Oscillatory Marangoni Flow in Encapsulated Liquid Bridge

Lan Peng, You-Rong Li, Nobuyuki Imaishi, Dan-Ling Zeng, Qing-Hua Chen
Proc. ASME. IMECE2005, Heat Transfer, Part B, 939-944, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-80795
https://doi.org/10.1115/IMECE2005-80795
View Paper titled, Numerical Simulation of Oscillatory Marangoni Flow in Encapsulated Liquid Bridge
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Topics: Bridges (Structures), Computer simulation, Flow (Dynamics)
Proceedings Papers

Numerical Analysis of Marangoni Convection in Liquid Bridge With Liquid Encapsulation: Effect of Temperature Coefficient of Tension

Lan Peng, Yourong Li, Juanfang Liu, Tien-Chien Jen, Qinghua Chen
Proc. ASME. IMECE2006, Heat Transfer, Volume 2, 577-582, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-14541
https://doi.org/10.1115/IMECE2006-14541
View Paper titled, Numerical Analysis of Marangoni Convection in Liquid Bridge With Liquid Encapsulation: Effect of Temperature Coefficient of Tension
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Topics: Bridges (Structures), Convection, Numerical analysis, Temperature, Tension, Computer simulation, Flow (Dynamics), Surface tension, Vorticity