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Krishna Tunga
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Journal Articles

Far Back End of Line Aluminum Stress Reduction Methods for Two-Dimensional/2.5D Fine Pitch Assemblies

Krishna Tunga, Thomas Wassick, Maryse Cournoyer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031004.
Paper No: EP-16-1110
https://doi.org/10.1115/1.4036368
Published Online: June 14, 2017
View Article titled, Far Back End of Line Aluminum Stress Reduction Methods for Two-Dimensional/2.5D Fine Pitch Assemblies
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Topics: Aluminum, Stress, Solder joints, Design
Proceedings Papers

Study on the Choice of Constitutive and Fatigue Models in Solder Joint Life Prediction

Krishna Tunga, James Pyland, Raghuram V. Pucha, Suresh K. Sitaraman
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 329-335, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39676
https://doi.org/10.1115/IMECE2002-39676
View Paper titled, Study on the Choice of Constitutive and Fatigue Models in Solder Joint Life Prediction
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Topics: Constitutive equations, Fatigue, Solder joints, Solders, Fatigue life, Ball-Grid-Array packaging, Damage
Proceedings Papers

Thermo-Mechanical Fatigue Life Estimation of Organic BGA Packages Using Laser Moire Interferometry

Krishna Tunga, Suresh K. Sitaraman
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 177-181, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-13615
https://doi.org/10.1115/IMECE2006-13615
View Paper titled, Thermo-Mechanical Fatigue Life Estimation of Organic BGA Packages Using Laser Moire Interferometry
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Topics: Ball-Grid-Array packages, Fatigue life, Interferometry, Lasers, Solders, Thermomechanics
Journal Articles

An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls

Krishna Tunga, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 427–433.
https://doi.org/10.1115/1.2804091
Published Online: February 13, 2007
View Article titled, An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls
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Topics: Ball-Grid-Array packaging, Ceramics, Fatigue life, Solders, Ball-Grid-Array packages, Interferometry, Lasers
Journal Articles

Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment

Raghuram V. Pucha, Krishna Tunga, James Pyland, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 256–264.
https://doi.org/10.1115/1.1756150
Published Online: July 8, 2004
View Article titled, Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment
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Topics: Avionics, Creep, Cycles, Military systems, Solders, Temperature, Damage