1-5 of 5
Kaustubh Nagarkar
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor Devices

Liang Yin, Christopher Kapusta, Arun Gowda, Kaustubh Nagarkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031009.
Paper No: EP-17-1113
https://doi.org/10.1115/1.4040499
Published Online: July 2, 2018
View Article titled, A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor Devices
Open the PDF for A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor Devices in another window
Topics: Overlays (Materials engineering), Packaging, Power semiconductor devices, Reliability, Silicon, Wire, Gates (Closures), Manufacturing, Temperature, Heat sinks
Proceedings Papers

Novel Flexible Interconnects and Packaging for Minimally Invasive Medical Electronics

Kaustubh Nagarkar, Craig Galligan, Michael Klitzke, James Rose, Binoy Shah, Donna Sherman
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A031, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48704
https://doi.org/10.1115/IPACK2015-48704
View Paper titled, Novel Flexible Interconnects and Packaging for Minimally Invasive Medical Electronics
Open the PDF for Novel Flexible Interconnects and Packaging for Minimally Invasive Medical Electronics in another window
Topics: Biomedicine, Electronics, Packaging, Circuits, Laminates, Manufacturing, Microelectromechanical systems, Pressure sensors, Sensors
Proceedings Papers

Highly Manufacturable and Reliable CZT Detectors

Bill Burdick, Jeff Erlbaum, Kaustubh Nagarkar, Brian Yanoff, Liang Yin, Raj Bahadur, Esmaeil Heidari, Donna Sherman, James E. Simpson
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73314
https://doi.org/10.1115/IPACK2013-73314
View Paper titled, Highly Manufacturable and Reliable CZT Detectors
Open the PDF for Highly Manufacturable and Reliable CZT Detectors in another window
Topics: Sensors, Reliability, Design, Finite element model, Manufacturing, Packaging, Radiation detectors, Semiconductors (Materials), Accelerated life testing, Ceramics
Proceedings Papers

Thermal and Mechanical Properties of Silicone Thermal Interface Materials With Varying Cross-Link Densities

Arun Gowda, Annita Zhong, Sandeep Tonapi, Kaustubh Nagarkar, K. Srihari
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1911-1918, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73490
https://doi.org/10.1115/IPACK2005-73490
View Paper titled, Thermal and Mechanical Properties of Silicone Thermal Interface Materials With Varying Cross-Link Densities
Open the PDF for Thermal and Mechanical Properties of Silicone Thermal Interface Materials With Varying Cross-Link Densities in another window
Topics: Mechanical properties, Silicones, Heat, Adhesives, Fillers (Materials), Flat heat pipes, Microelectronic devices, Phase change materials, Pumps, Resins
Proceedings Papers

Development of No Flow Underfills for Lead-Free Flip Chip Applications

Kaustubh Nagarkar, Tan Zhang, David Esler, David Simon, Paul Gillespie, Sandeep Tonapi, Prameela Susarla, Ryan Mills
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 67-72, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-13420
https://doi.org/10.1115/IMECE2006-13420
View Paper titled, Development of No Flow Underfills for Lead-Free Flip Chip Applications
Open the PDF for Development of No Flow Underfills for Lead-Free Flip Chip Applications in another window
Topics: Flip-chip devices, Flow (Dynamics), Manufacturing, Packaging, Flip-chip, Electronic packaging, Electronics, Flip-chip assemblies, High temperature, Lead-free solders