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Proceedings Papers

Facility Cooling Failure Analysis of Direct Liquid Cooling System in Data Centers

Sami Alkharabsheh, Udaya L. N. Puvvadi, Bharath Ramakrishnan, Kanad Ghose, Bahgat Sammakia
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8443
https://doi.org/10.1115/IPACK2018-8443
View Paper titled, Facility Cooling Failure Analysis of Direct Liquid Cooling System in Data Centers
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Topics: Cooling, Cooling systems, Data centers, Failure analysis, Failure, Temperature, Coolants, Heat
Journal Articles

Failure Analysis of Direct Liquid Cooling System in Data Centers

Sami Alkharabsheh, Udaya L. N. Puvvadi, Bharath Ramakrishnan, Kanad Ghose, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020902.
Paper No: EP-17-1094
https://doi.org/10.1115/1.4039137
Published Online: May 9, 2018
View Article titled, Failure Analysis of Direct Liquid Cooling System in Data Centers
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Topics: Cooling systems, Data centers, Failure, Temperature, Cooling, Flow (Dynamics), Coolants
Proceedings Papers

Ranking and Optimization of CAC and HAC Leakage Using Pressure Controlled Models

Husam A. Alissa, Kourosh Nemati, Bahgat Sammakia, Kanad Ghose, Mark Seymour, David King, Russell Tipton
Proc. ASME. IMECE2015, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A043, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-50782
https://doi.org/10.1115/IMECE2015-50782
View Paper titled, Ranking and Optimization of CAC and HAC Leakage Using Pressure Controlled Models
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Topics: Leakage, Optimization, Pressure, Containment, Data centers, Cooling, Doors, Flow (Dynamics), Air flow, Ceilings
Journal Articles

A Brief Overview of Recent Developments in Thermal Management in Data Centers

Sami Alkharabsheh, John Fernandes, Betsegaw Gebrehiwot, Dereje Agonafer, Kanad Ghose, Alfonso Ortega, Yogendra Joshi, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 040801.
Paper No: EP-14-1117
https://doi.org/10.1115/1.4031326
Published Online: September 10, 2015
View Article titled, A Brief Overview of Recent Developments in Thermal Management in Data Centers
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Topics: Computational fluid dynamics, Cooling, Data centers, Modeling, Temperature, Tiles, Thermal management
Journal Articles

Solving Thermal Issues in a Three-Dimensional-Stacked-Quad-Core Processor by Microprocessor Floor Planning, Microchannel Cooling, and Insertion of Through-Silicon-Vias

Anjali Chauhan, Bahgat Sammakia, Furat F. Afram, Kanad Ghose, Gamal Refai-Ahmed, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041006.
Paper No: EP-12-1106
https://doi.org/10.1115/1.4025531
Published Online: November 5, 2013
View Article titled, Solving Thermal Issues in a Three-Dimensional-Stacked-Quad-Core Processor by Microprocessor Floor Planning, Microchannel Cooling, and Insertion of Through-Silicon-Vias
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Topics: Cooling, Flow (Dynamics), Heat sinks, Microchannels, Temperature
Proceedings Papers

Liquid Cooling of a Stacked Quad-Core Processor and DRAM Using Laminar Flow in Microchannels

Anjali Chauhan, Bahgat Sammakia, Furat F. Afram, Kanad Ghose, Gamal Refai-Ahmed, Dereje Agonafer
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 927-940, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-65866
https://doi.org/10.1115/IMECE2011-65866
View Paper titled, Liquid Cooling of a Stacked Quad-Core Processor and DRAM Using Laminar Flow in Microchannels
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Topics: Cooling, Laminar flow, Microchannels, Flow (Dynamics), Heat sinks, Thermal resistance, Delays, Design, Energy dissipation, Reliability
Proceedings Papers

Characterization of a Server Thermal Mass Using Experimental Measurements

Mahmoud Ibrahim, Furat Afram, Bahgat Sammakia, Kanad Ghose, Bruce Murray, Madhusudan Iyengar, Roger Schmidt
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 577-583, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52165
https://doi.org/10.1115/IPACK2011-52165
View Paper titled, Characterization of a Server Thermal Mass Using Experimental Measurements
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Topics: Cooling, Data centers, Electronic equipment, Energy dissipation, Energy efficiency, Fans, Heat, Materials properties, Sensors, Steady state
Proceedings Papers

Single-Phase Microchannel Cooling for Stacked Single Core Chip and DRAM

Anjali Chauhan, Bahgat Sammakia, Kanad Ghose, Gamal Refai-Ahmed, Dereje Agonafer
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 225-234, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52137
https://doi.org/10.1115/IPACK2011-52137
View Paper titled, Single-Phase Microchannel Cooling for Stacked Single Core Chip and DRAM
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Topics: Cooling, Microchannels, Heat sinks, Thermal management, Thermal resistance, Architecture, Cooling systems, Energy dissipation, Silicon
Proceedings Papers

Single-Phase Liquid Cooling of a Quad-Core Processor

Anjali Chauhan, Bahgat Sammakia, Furat F. Afram, Kanad Ghose, Gamal Refai-Ahmed, Dereje Agonafer
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 235-245, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52139
https://doi.org/10.1115/IPACK2011-52139
View Paper titled, Single-Phase Liquid Cooling of a Quad-Core Processor
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Topics: Cooling, Flow (Dynamics), Microchannels, Energy dissipation, Heat, Temperature, Cooling systems, Design, Engineering standards, Failure
Journal Articles

Thermal Design Criteria for Extraordinary Performance of Devices Cooled by Microchannel Heat Sink

Dylan Farnam, Bahgat Sammakia, Kanad Ghose
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2010, 2(4): 041001.
https://doi.org/10.1115/1.4002841
Published Online: January 6, 2011
View Article titled, Thermal Design Criteria for Extraordinary Performance of Devices Cooled by Microchannel Heat Sink
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Topics: Design, Heat sinks, Microchannels, Temperature gradient, Temperature, Cooling, Computer simulation
Proceedings Papers

Development of a Numerical Model for Non-Uniformly Powered Die to Improve Both Thermal and Device Clock Performance

Saket Karajgikar, Dereje Agonafer, Kanad Ghose, Bahgat Sammakia, Cristina Amon, Gamal Refai-Ahmed
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 111-118, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89188
https://doi.org/10.1115/InterPACK2009-89188
View Paper titled, Development of a Numerical Model for Non-Uniformly Powered Die to Improve Both Thermal and Device Clock Performance
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Topics: Clocks, Computer simulation, Computers, Control equipment, Junctions, Pareto optimization, Product reliability, Temperature, Temperature gradient
Proceedings Papers

Effect of Relocation of Functional Units of a Non-Uniformly Powered Microprocessor on Thermal and Device Clock Performance

Saket Karajgikar, Dereje Agonafer, Kanad Ghose, Bahgat Sammakia, Cristina Amon, Gamal Refai-Ahmad
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 179-184, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11769
https://doi.org/10.1115/IMECE2009-11769
View Paper titled, Effect of Relocation of Functional Units of a Non-Uniformly Powered Microprocessor on Thermal and Device Clock Performance
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Topics: Clocks, Temperature, Computers, Junctions, Control equipment, Numerical analysis, Pareto optimization, Product reliability, Temperature gradient
Journal Articles

Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture

Saket Karajgikar, Dereje Agonafer, Kanad Ghose, Bahgat Sammakia, Cristina Amon, Gamal Refai-Ahmed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021008.
https://doi.org/10.1115/1.4001852
Published Online: June 25, 2010
View Article titled, Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture
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Topics: Junctions, Temperature, Pareto optimization, Delays, Temperature gradient, Engines
Proceedings Papers

Comparative Analysis of Microchannel Cooling Schemes Subject to a Pressure Constraint

Dylan Farnam, Bahgat Sammakia, Harold Ackler, Kanad Ghose
Proc. ASME. ICNMM2007, ASME 5th International Conference on Nanochannels, Microchannels, and Minichannels, 277-284, June 18–20, 2007
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2007-30187
https://doi.org/10.1115/ICNMM2007-30187
View Paper titled, Comparative Analysis of Microchannel Cooling Schemes Subject to a Pressure Constraint
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Topics: Cooling, Microchannels, Pressure, Flow (Dynamics), Design, Operating temperature, Pressure drop, Stress, Energy dissipation, Energy resources