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Jeffrey C. Suhling
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Proceedings Papers

Effects of Grain to Sample Volume Ratio on the Deformation Behavior of Polycrystal SAC Samples Subjected to Shear Loads

Debabrata Mondal, Jeffrey C. Suhling, Elham Mirkoohi, Pradeep Lall
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112034
https://doi.org/10.1115/IPACK2023-112034
View Paper titled, Effects of Grain to Sample Volume Ratio on the Deformation Behavior of Polycrystal SAC Samples Subjected to Shear Loads
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Topics: Crystals, Deformation, Dislocations, Plasticity, Shear (Mechanics), Stress
Proceedings Papers

Incorporation of Damage in Creep Models for SAC305 Lead Free Solder

Golam Rakib Mazumder, Souvik Chakraborty, Mahbub Alam Maruf, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112030
https://doi.org/10.1115/IPACK2023-112030
View Paper titled, Incorporation of Damage in Creep Models for SAC305 Lead Free Solder
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Topics: Creep, Damage, Energy dissipation, Lead-free solders
Proceedings Papers

Comparative Finite Element Analyses of the Thermal Cycling Performances of BGA Packages With SAC, LTS, and Mixed SAC-LTS Solder Joints

Souvik Chakraborty, Debabrata Mondal, Golam Rakib Mazumder, Mahbub Alam Maruf, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112041
https://doi.org/10.1115/IPACK2023-112041
View Paper titled, Comparative Finite Element Analyses of the Thermal Cycling Performances of BGA Packages With SAC, LTS, and Mixed SAC-LTS Solder Joints
Open the PDF for Comparative Finite Element Analyses of the Thermal Cycling Performances of BGA Packages With SAC, LTS, and Mixed SAC-LTS Solder Joints in another window
Topics: Ball-Grid-Array packages, Ball-Grid-Array packaging, Fatigue life, Finishes, Finite element analysis, Reliability, Solder joints
Proceedings Papers

Evolution in Lead-Free Solder Alloys Subjected to Both Mechanical Cycling and Aging

Mahbub Alam Maruf, Golam Rakib Mazumder, Souvik Chakraborty, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112023
https://doi.org/10.1115/IPACK2023-112023
View Paper titled, Evolution in Lead-Free Solder Alloys Subjected to Both Mechanical Cycling and Aging
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Topics: Alloys, Lead-free solders, Nanoindentation
Proceedings Papers

Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder

Golam Rakib Mazumder, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-93878
https://doi.org/10.1115/IPACK2022-93878
View Paper titled, Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder
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Topics: Creep, Damage, Lead-free solders, Solders
Proceedings Papers

Advances in Stress Test Chips

Richard C. Jaeger, Jeffrey C. Suhling
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 1-5, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1220
https://doi.org/10.1115/IMECE1997-1220
View Paper titled, Advances in Stress Test Chips
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Topics: Stress, Sensors, Silicon, Circuits, Electronic packages, Energy dissipation, Integrated circuits, Operating temperature, Reliability, Resistors
Proceedings Papers

Die Stress Measurements Using High Temperature Die-Attachment Materials

Yida Zou, Jeffrey C. Suhling, Richard C. Jaeger, Shun-Tien Lin, Jeffrey T. Benoit, Richard R. Grzybowski
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 107-117, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0436
https://doi.org/10.1115/IMECE1998-0436
View Paper titled, Die Stress Measurements Using High Temperature Die-Attachment Materials
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Topics: High temperature, Stress, Temperature, Adhesives, Sensors, Ceramics, Engineering simulation, Finite element analysis, Glass, Packaging
Proceedings Papers

Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys

Mohd Aminul Hoque, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A014, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73548
https://doi.org/10.1115/IPACK2021-73548
View Paper titled, Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys
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Topics: Alloys, Creep, Lead-free solders, Stress-strain curves, Temperature
Proceedings Papers

Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints

Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A011, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73348
https://doi.org/10.1115/IPACK2021-73348
View Paper titled, Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints
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Topics: Intermetallic compounds, Lead-free solders, Solder joints, Alloys, Reliability, Copper, Elastic moduli, Electronic packaging, Nanoindentation, Polishing
Proceedings Papers

Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

S. M. Kamrul Hasan, Abdullah Fahim, Mohammad Al Ahsan, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74044
https://doi.org/10.1115/IPACK2021-74044
View Paper titled, Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures
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Topics: Lead-free solders, Mechanical properties, Solder joints, Solders, Tensile strength, Thermal shock, Yield strength, Stress, Cycles, High temperature
Proceedings Papers

Deformation Behavior of SAC305 Solder Joints With Multiple Grains

Debabrata Mondal, Abdullah Fahim, KM Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2694
https://doi.org/10.1115/IPACK2020-2694
View Paper titled, Deformation Behavior of SAC305 Solder Joints With Multiple Grains
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Topics: Anisotropy, Deformation, Grain size, Solder joints
Proceedings Papers

Creep Behavior of Various Materials Within PBGA Packages Subjected to Thermal Cycling Loading

Abdullah Fahim, Kamrul Hasan, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2655
https://doi.org/10.1115/IPACK2020-2655
View Paper titled, Creep Behavior of Various Materials Within PBGA Packages Subjected to Thermal Cycling Loading
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Topics: Creep, Nanoindentation, Solder masks
Proceedings Papers

Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging

Jing Wu, Mohammad S. Alam, KM Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2695
https://doi.org/10.1115/IPACK2020-2695
View Paper titled, Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging
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Topics: Intermetallic compounds, Lead-free solders, Solders, Particulate matter, Tin, Alloys, Mechanical behavior, Diffusion (Physics), High temperature, Mechanical properties
Proceedings Papers

Determination of Anand Parameters From Creep Testing of SAC305 Solder Joints

Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2690
https://doi.org/10.1115/IPACK2020-2690
View Paper titled, Determination of Anand Parameters From Creep Testing of SAC305 Solder Joints
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Topics: Creep, Solder joints, Testing
Proceedings Papers

Study of Lead Free Solder Joints Subjected to Isothermal Mechanical Shear Cycling

Mohd Aminul Hoque, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2692
https://doi.org/10.1115/IPACK2020-2692
View Paper titled, Study of Lead Free Solder Joints Subjected to Isothermal Mechanical Shear Cycling
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Topics: Lead-free solders, Recrystallization, Shear (Mechanics)
Proceedings Papers

Evaluation of the Creep Response of Lead Free Solder Materials Subjected to Thermal Cycling

S. M. Kamrul Hasan, Abdullah Fahim, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2693
https://doi.org/10.1115/IPACK2020-2693
View Paper titled, Evaluation of the Creep Response of Lead Free Solder Materials Subjected to Thermal Cycling
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Topics: Creep, Lead-free solders
Proceedings Papers

Time-Lapse Imagery and Quantitative Analysis of Microstructural Evolution of SAC305 BGA Joints During Extreme High Temperature Aging

KM Rafidh Hassan, Mohammad S. Alam, Jing Wu, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2691
https://doi.org/10.1115/IPACK2020-2691
View Paper titled, Time-Lapse Imagery and Quantitative Analysis of Microstructural Evolution of SAC305 BGA Joints During Extreme High Temperature Aging
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Topics: Ball-Grid-Array packaging, High temperature, Lead-free solders, Particulate matter
Proceedings Papers

Atomistic Investigation on Mechanical Properties of Sn-Ag-Cu Based Nanocrystalline Solder Material

Mohammad Motalab, Rafsan A. S. I. Subad, Ayesha Ahmed, Pritom Bose, Ratul Paul, Jeffrey C. Suhling
Proc. ASME. IMECE2019, Volume 12: Advanced Materials: Design, Processing, Characterization, and Applications, V012T10A035, November 11–14, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2019-12109
https://doi.org/10.1115/IMECE2019-12109
View Paper titled, Atomistic Investigation on Mechanical Properties of Sn-Ag-Cu Based Nanocrystalline Solder Material
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Topics: Mechanical properties, Solders, Tin, Tensile strength, Simulation, Temperature, Atoms, Crystals, Ductility, Electrical components
Proceedings Papers

Nanoindentation Testing of SAC305 Solder Joints Subjected to Thermal Cycling Loading

Abdullah Fahim, S. M. Kamrul Hasan, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6471
https://doi.org/10.1115/IPACK2019-6471
View Paper titled, Nanoindentation Testing of SAC305 Solder Joints Subjected to Thermal Cycling Loading
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Topics: Creep, Nanoindentation, Solder joints, Testing
Proceedings Papers

Evolution of the Microstructure of Lead Free Solders Subjected to Both Aging and Cyclic Loading

Md Mahmudur R. Chowdhury, Mohd Aminul Hoque, Jeffrey C. Suhling, Sa’d Hamasha, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6560
https://doi.org/10.1115/IPACK2019-6560
View Paper titled, Evolution of the Microstructure of Lead Free Solders Subjected to Both Aging and Cyclic Loading
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Topics: Lead-free solders