1-10 of 10
J. Fan
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

High Temperature Characteristics of a Carbon Strip Sliding against Copper with Electrical Current

T. Ding, Q. D. He, Yi Yang, Y. J. Fan, J. Yuan, S. Q. Wang
Journal: Materials Performance and Characterization
Publisher: ASTM International
Article Type: Technical Papers
Matls. Perf. Charact.. February 2018, 7(1): 101–112.
Paper No: MPC20170087
https://doi.org/10.1520/MPC20170087
Published Online: March 15, 2018
View Article titled, High Temperature Characteristics of a Carbon Strip Sliding against Copper with Electrical Current
Open the PDF for High Temperature Characteristics of a Carbon Strip Sliding against Copper with Electrical Current in another window
Proceedings Papers

Theoretical and Experimental Study of Stress Corrosion Cracking of Pipeline Steel in Near Neutral pH Environment

B. Zhang, J. Fan, Y. Gogotsi, A. Chudnovsky, A. Teitsma
Proc. ASME. IPC2000, Volume 2: Integrity and Corrosion; Offshore Issues; Pipeline Automation and Measurement; Rotating Equipment, V002T06A045, October 1–5, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IPC2000-225
https://doi.org/10.1115/IPC2000-225
View Paper titled, Theoretical and Experimental Study of Stress Corrosion Cracking of Pipeline Steel in Near Neutral pH Environment
Open the PDF for Theoretical and Experimental Study of Stress Corrosion Cracking of Pipeline Steel in Near Neutral pH Environment in another window
Topics: Pipelines, Steel, Stress corrosion cracking, Fracture (Materials), Corrosion, Chemical processes, Computer simulation, Diffusion (Physics), Finite element methods, Hydrogen
Journal Articles

Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part II: Application to 3D Ultrathin Stacked-Die Chip Scale Packages

B. Xie, X. J. Fan, X. Q. Shi, H. Ding
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031011.
https://doi.org/10.1115/1.3144154
Published Online: July 31, 2009
View Article titled, Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part II: Application to 3D Ultrathin Stacked-Die Chip Scale Packages
Open the PDF for Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part II: Application to 3D Ultrathin Stacked-Die Chip Scale Packages in another window
Topics: Diffusion (Physics), Vapor pressure, Failure, Modeling
Journal Articles

Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation

B. Xie, X. J. Fan, X. Q. Shi, H. Ding
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031010.
https://doi.org/10.1115/1.3144147
Published Online: July 31, 2009
View Article titled, Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation
Open the PDF for Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation in another window
Topics: Diffusion (Physics), Modeling, Temperature, Vapor pressure, Electronic packages
Proceedings Papers

Fatigue Correction Coefficient for Oscillating Cantilever Plates With Impact

Jay P. Marsh, U. J. Fan
Proc. ASME. IMECE2004, Design Engineering, 289-298, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-61358
https://doi.org/10.1115/IMECE2004-61358
View Paper titled, Fatigue Correction Coefficient for Oscillating Cantilever Plates With Impact
Open the PDF for Fatigue Correction Coefficient for Oscillating Cantilever Plates With Impact in another window
Topics: Cantilevers, Fatigue, Plates (structures), Stress, Steel, Carbon, Energy levels (Quantum mechanics), Fatigue life, Heat treating (Metalworking)
Journal Articles

A Micromechanics-Based Vapor Pressure Model in Electronic Packages

X. J. Fan, J. Zhou, G. Q. Zhang, L. J. Ernst
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 262–267.
https://doi.org/10.1115/1.1939027
Published Online: June 26, 2004
View Article titled, A Micromechanics-Based Vapor Pressure Model in Electronic Packages
Open the PDF for A Micromechanics-Based Vapor Pressure Model in Electronic Packages in another window
Topics: Vapor pressure, Temperature, Micromechanics (Engineering), Vapors
Journal Articles

A Micro/Macroscopic Analysis for Cyclic Plasticity of Dual-Phase Materials

J. Fan
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. March 1999, 66(1): 124–136.
https://doi.org/10.1115/1.2789139
Published Online: March 1, 1999
View Article titled, A Micro/Macroscopic Analysis for Cyclic Plasticity of Dual-Phase Materials
Open the PDF for A Micro/Macroscopic Analysis for Cyclic Plasticity of Dual-Phase Materials in another window
Topics: Plasticity, Stress, Absorption, Cycles, Fatigue, Modeling
Journal Articles

Anisotropic Constraint Effects on Interactive Damage Progression of General Lay-up Composites

J. Fan, J. Zhang
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. December 1998, 65(4): 970–979.
https://doi.org/10.1115/1.2791941
Published Online: December 1, 1998
View Article titled, Anisotropic Constraint Effects on Interactive Damage Progression of General Lay-up Composites
Open the PDF for Anisotropic Constraint Effects on Interactive Damage Progression of General Lay-up Composites in another window
Topics: Anisotropy, Composite materials, Damage, Delamination, Fracture (Process), Plate theory, Shear deformation, Stiffness
eBook Chapter

In Situ Damage Progression in General Layup Composites

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1997
https://doi.org/10.1520/STP11876S
ISBN-10: 0-8031-2473-2
ISBN: 978-0-8031-2473-8
Open the PDF for In Situ Damage Progression in General Layup Composites in another window
Journal Articles

Endochronic Analysis of Cyclic Elastoplastic Strain Fields in a Notched Plate

K. C. Valanis, J. Fan
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. December 1983, 50(4a): 789–794.
https://doi.org/10.1115/1.3167147
Published Online: December 1, 1983
View Article titled, Endochronic Analysis of Cyclic Elastoplastic Strain Fields in a Notched Plate
Open the PDF for Endochronic Analysis of Cyclic Elastoplastic Strain Fields in a Notched Plate in another window
Topics: Bearings, Finite element analysis, Plasticity, Stress, Tension