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I. Charles Ume
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Proceedings Papers
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 55-62, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0775
Proceedings Papers
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 65-72, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0891
Proceedings Papers
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 789-794, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1093
Proceedings Papers
Proc. ASME. IMECE99, Manufacturing Science and Engineering, 659-668, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0727
Proceedings Papers
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 169-179, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0930
Proceedings Papers
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 1-7, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24700
Proceedings Papers
Proc. ASME. IMECE2001, Mechanical Engineering Design Education: Issues and Case Studies, 31-35, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/DE-23284
Proceedings Papers
Proc. ASME. IMECE2000, Manufacturing Engineering, 405-412, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1835
Proceedings Papers
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 189-195, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2262
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031007.
Paper No: EP-13-1074
Published Online: May 12, 2014
Proceedings Papers
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A084, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-66484
Proceedings Papers
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A081, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-65072
Proceedings Papers
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 941-948, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-63147
Proceedings Papers
Proc. ASME. IMECE2011, Volume 3: Design and Manufacturing, 431-439, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-62972
Proceedings Papers
Proc. ASME. IMECE2011, Volume 1: Advances in Aerospace Technology; Energy Water Nexus; Globalization of Engineering; Posters, 743-749, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-62766
Proceedings Papers
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 507-516, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-39970
Proceedings Papers
Measurement of Weld Dimensions of Butt Joint Welding in Thin Plates Using Superimposed Laser Sources
Proc. ASME. IMECE2010, Volume 3: Design and Manufacturing, Parts A and B, 549-561, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-38212
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 95-103, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52294
Proceedings Papers
Proc. ASME. IMECE2009, Volume 4: Design and Manufacturing, 419-425, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-10831
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021006.
Published Online: June 23, 2010
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