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Journal Articles

Design of the Magnetic Stamp Film for Electromagnetic-Assisted Transfer Printing

Qingmin Yu, Anran Li, Xudong Yu, Honglei Zhou, Huanyu Cheng
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. July 2021, 88(7): 071006.
Paper No: JAM-21-1091
https://doi.org/10.1115/1.4050536
Published Online: April 7, 2021
View Article titled, Design of the Magnetic Stamp Film for Electromagnetic-Assisted Transfer Printing
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Topics: Deformation, Displacement, Magnetic fields, Magnetic particles, Printing, Design, Pressure
Journal Articles

Design and Analysis of Magnetic-Assisted Transfer Printing

Qinming Yu, Furong Chen, Honglei Zhou, Xudong Yu, Huanyu Cheng, Huaping Wu
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. October 2018, 85(10): 101009.
Paper No: JAM-18-1283
https://doi.org/10.1115/1.4040599
Published Online: July 5, 2018
View Article titled, Design and Analysis of Magnetic-Assisted Transfer Printing
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Topics: Design, Displacement, Magnetic fields, Plasma desorption mass spectrometry, Pressure, Printing, Thin films, Adhesion
Journal Articles

Assembly of Heterogeneous Materials for Biology and Electronics: From Bio-Inspiration to Bio-Integration

Yuyan Gao, Huanyu Cheng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2017, 139(2): 020801.
Paper No: EP-16-1131
https://doi.org/10.1115/1.4036238
Published Online: June 13, 2017
View Article titled, Assembly of Heterogeneous Materials for Biology and Electronics: From Bio-Inspiration to Bio-Integration
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Topics: Electronics, Manufacturing, Printing, Biology
Journal Articles

Mechanics of Solar Module on Structured Substrates

Zhuangjian Liu, Huanyu Cheng, Jian Wu
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Briefs
J. Appl. Mech. June 2014, 81(6): 064502.
Paper No: JAM-13-1511
https://doi.org/10.1115/1.4026472
Published Online: February 4, 2014
View Article titled, Mechanics of Solar Module on Structured Substrates
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Topics: Buckling, Deflection, Deformation, Optimization, Solar energy, Electronics, Finite element analysis, Design
Journal Articles

A Simply Analytic Study of Buckled Thin Films on Compliant Substrates

Huanyu Cheng, Jizhou Song
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Briefs
J. Appl. Mech. February 2014, 81(2): 024501.
Paper No: JAM-13-1349
https://doi.org/10.1115/1.4025306
Published Online: October 29, 2013
View Article titled, A Simply Analytic Study of Buckled Thin Films on Compliant Substrates
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Topics: Buckling, Geometry, Thin films, Wavelength, Deformation, Membranes, Finite element methods
Journal Articles

Mechanics of Interfacial Delamination in Epidermal Electronics Systems

Huanyu Cheng, Shuodao Wang
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Briefs
J. Appl. Mech. April 2014, 81(4): 044501.
Paper No: JAM-13-1330
https://doi.org/10.1115/1.4025305
Published Online: October 16, 2013
View Article titled, Mechanics of Interfacial Delamination in Epidermal Electronics Systems
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Topics: Delamination, Electronics, Skin, Surface roughness
Journal Articles

A Finite-Deformation Mechanics Theory for Kinetically Controlled Transfer Printing

Xue Feng, Huanyu Cheng, Audrey M. Bowen, Andrew W. Carlson, Ralph G. Nuzzo, John A. Rogers
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. November 2013, 80(6): 061023.
Paper No: JAM-12-1567
https://doi.org/10.1115/1.4023963
Published Online: August 21, 2013
View Article titled, A Finite-Deformation Mechanics Theory for Kinetically Controlled Transfer Printing
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Topics: Deformation, Delamination, Plasma desorption mass spectrometry, Printing, Stiffness