1-9 of 9
Guo-Quan Lu
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Effects of Pores on Crack Propagation in Sintered-Silver Die Attach: A Baseline Model

Emmanuel Arriola, Guo-Quan Lu, Aristotle Ubando
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A015, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113208
https://doi.org/10.1115/IPACK2023-113208
View Paper titled, Effects of Pores on Crack Propagation in Sintered-Silver Die Attach: A Baseline Model
Open the PDF for Effects of Pores on Crack Propagation in Sintered-Silver Die Attach: A Baseline Model in another window
Topics: Crack propagation, Reliability, Silver
Proceedings Papers

Evaluation of a Lead Glass for Encapsulating High-Temperature Power Modules for Aerospace Application

Lanbing Liu, David Nam, Ben Guo, Rolando Burgos, Guo-quan Lu
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A006, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6393
https://doi.org/10.1115/IPACK2019-6393
View Paper titled, Evaluation of a Lead Glass for Encapsulating High-Temperature Power Modules for Aerospace Application
Open the PDF for Evaluation of a Lead Glass for Encapsulating High-Temperature Power Modules for Aerospace Application in another window
Topics: Aerospace industry, Glass, High temperature, Packaging, Stress
Proceedings Papers

Mechanical Characterization Study of Sintered Silver Pastes Bonded in a Double-Lap Configuration

Paul Paret, Joshua Major, Douglas DeVoto, Sreekant Narumanchi, Yansong Tan, Guo-Quan Lu
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8276
https://doi.org/10.1115/IPACK2018-8276
View Paper titled, Mechanical Characterization Study of Sintered Silver Pastes Bonded in a Double-Lap Configuration
Open the PDF for Mechanical Characterization Study of Sintered Silver Pastes Bonded in a Double-Lap Configuration in another window
Topics: Silver, Particulate matter, Pressure, Collaboration, Displacement, Electronics, Energy gap, High pressure (Physics), High temperature, Manufacturing
Journal Articles

Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode

Yi Yan, Youliang Guan, Xu Chen, Guo-Quan Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041003.
Paper No: EP-13-1030
https://doi.org/10.1115/1.4025247
Published Online: September 4, 2013
View Article titled, Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode
Open the PDF for Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode in another window
Topics: High power lasers, Lasers, Silver, Thermal stresses, Finite element analysis, Temperature, Wavelength, Currents, Simulation, Manufacturing
Journal Articles

Die Bonding of High Power 808 nm Laser Diodes With Nanosilver Paste

Yi Yan, Xu Chen, Xingsheng Liu, Yunhui Mei, Guo-Quan Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041003.
https://doi.org/10.1115/1.4007271
Published Online: August 29, 2012
View Article titled, Die Bonding of High Power 808 nm Laser Diodes With Nanosilver Paste
Open the PDF for Die Bonding of High Power 808 nm Laser Diodes With Nanosilver Paste in another window
Topics: Lasers, Bonding
Journal Articles

Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

Xin Li, Xu Chen, Guo-Quan Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031011.
https://doi.org/10.1115/1.4002299
Published Online: September 30, 2010
View Article titled, Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials
Open the PDF for Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials in another window
Topics: Bonding, Epoxy adhesives, Epoxy resins, Light-emitting diodes, Packaging, Reliability, Silver, Temperature, Tin, Heat
Proceedings Papers

Strategies for Improving Reliability of Solder Joints on Power Semiconductor Devices

Guo-Quan Lu, Xingsheng Liu, Sihua Wen, Jesus Noel Calata, John G. Bai
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 247-256, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41993
https://doi.org/10.1115/IMECE2003-41993
View Paper titled, Strategies for Improving Reliability of Solder Joints on Power Semiconductor Devices
Open the PDF for Strategies for Improving Reliability of Solder Joints on Power Semiconductor Devices in another window
Topics: Flip-chip, Power semiconductor devices, Reliability, Solder joints, Stress, Thermomechanics
Proceedings Papers

Low-Temperature Sintering of Nanoscale Silver Pastes for High-Performance and Highly-Reliable Device Interconnection

John G. Bai, Zach Z. Zhang, Jesus N. Calata, Guo-Quan Lu
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 415-424, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-79187
https://doi.org/10.1115/IMECE2005-79187
View Paper titled, Low-Temperature Sintering of Nanoscale Silver Pastes for High-Performance and Highly-Reliable Device Interconnection
Open the PDF for Low-Temperature Sintering of Nanoscale Silver Pastes for High-Performance and Highly-Reliable Device Interconnection in another window
Topics: Low temperature, Nanoscale phenomena, Silver, Sintering
Journal Articles

Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability

John G. Bai, Jesus N. Calata, Guo-Quan Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 208–214.
https://doi.org/10.1115/1.2229218
Published Online: August 26, 2005
View Article titled, Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability
Open the PDF for Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability in another window
Topics: Cooling, Finite element analysis, Reliability, Solders, Temperature, Stress, Thermomechanics, Thermal expansion