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Journal Articles

Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding

Bo Wu, Shuanghai Zhang, Fuliang Wang, Zhuo Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2018, 140(4): 044502.
Paper No: EP-18-1015
https://doi.org/10.1115/1.4040794
Published Online: August 6, 2018
View Article titled, Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding
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Topics: Bonding, Columns (Structural), Flip-chip, Copper, Flip-chip devices
Journal Articles

Modeling and Experimental Study of a Wire Clamp for Wire Bonding

Fuliang Wang, Dengke Fan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011012.
Paper No: EP-14-1035
https://doi.org/10.1115/1.4028836
Published Online: March 1, 2015
View Article titled, Modeling and Experimental Study of a Wire Clamp for Wire Bonding
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Topics: Clamps (Tools), Wire, Wire bonding
Journal Articles

High-Frequency and Low-Temperature Thermosonic Bonding of Lead-Free Microsolder Ball on Silver Pad Without Flux

Fuliang Wang, Junhui Li, Lei Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031001.
Paper No: EP-12-1083
https://doi.org/10.1115/1.4026877
Published Online: May 5, 2014
View Article titled, High-Frequency and Low-Temperature Thermosonic Bonding of Lead-Free Microsolder Ball on Silver Pad Without Flux
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Topics: Bonding, Low temperature, Silver
Journal Articles

Experimental and Modeling Studies of Looping Process for Wire Bonding

Fuliang Wang, Yun Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041009.
Paper No: EP-13-1070
https://doi.org/10.1115/1.4025667
Published Online: November 18, 2013
View Article titled, Experimental and Modeling Studies of Looping Process for Wire Bonding
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Topics: Wire, Materials properties, Finite element model
Journal Articles

Variable-Length Link-Spring Model for Kink Formation During Wire Bonding

Fuliang Wang, Weidong Tang, Junhui Li, Lei Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041004.
Paper No: EP-12-1061
https://doi.org/10.1115/1.4025308
Published Online: September 19, 2013
View Article titled, Variable-Length Link-Spring Model for Kink Formation During Wire Bonding
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Topics: Springs, Wire, Wire bonding, Deformation