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Edvin Cetegen
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Journal Articles

High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

Santosh Sankarasubramanian, Jaime Cruz, Kyle Yazzie, Vaasavi Sundar, Vijay Subramanian, Tsgereda Alazar, Sivakumar Yagnamurthy, Edvin Cetegen, David McCoy, Pramod Malatkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020902.
Paper No: EP-16-1149
https://doi.org/10.1115/1.4036356
Published Online: April 24, 2017
View Article titled, High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method
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Topics: Adhesion, Cantilever beams, Silicon, Solder masks, Temperature, Testing, High temperature, Adhesives
Proceedings Papers

High Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

Santosh Sankarasubramanian, Jaime Cruz, Kyle Yazzie, Vaasavi Sundar, Vijay Subramanian, Edvin Cetegen, David McCoy, Pramod Malatkar
Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A047, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-67007
https://doi.org/10.1115/IMECE2016-67007
View Paper titled, High Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method
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Topics: Adhesion, Cantilever beams, Electronic packaging, High temperature, Temperature, Adhesives, Testing, Manufacturing, Accelerated life testing, Failure mechanisms
Proceedings Papers

Thermal Performance of an Air-Cooled Micro-Grooved Heat Sink

Paul Kalinowski, Edvin Cetegen, Serguei Dessiatoun, John Lawler
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 741-752, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23326
https://doi.org/10.1115/IHTC14-23326
View Paper titled, Thermal Performance of an Air-Cooled Micro-Grooved Heat Sink
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Topics: Heat sinks, Computational fluid dynamics, Cooling, Engineering prototypes, Engineering simulation, Heat transfer coefficients, Manifolds, Optimization, Pressure drop, Simulation
Proceedings Papers

Multi Objective Optimization of a Force Fed Microchannel Heat Sink

Edvin Cetegen, Serguei Dessiatoun, Michael Ohadi
Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3, 93-100, December 18–21, 2009
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2009-18150
https://doi.org/10.1115/MNHMT2009-18150
View Paper titled, Multi Objective Optimization of a Force Fed Microchannel Heat Sink
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Topics: Heat sinks, Microchannels, Pareto optimization, Design, Heat transfer, Optimization, Approximation, Computer simulation, Flow (Dynamics), Genetic algorithms
Proceedings Papers

Heat Transfer Analysis of Force Fed Evaporation on Microgrooved Surfaces

Edvin Cetegen, Serguei Dessiatoun, Michael Ohadi
Proc. ASME. ICNMM2008, ASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels, 657-660, June 23–25, 2008
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2008-62285
https://doi.org/10.1115/ICNMM2008-62285
View Paper titled, Heat Transfer Analysis of Force Fed Evaporation on Microgrooved Surfaces
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Topics: Evaporation, Heat transfer, Heat flux, Pressure, Flux (Metallurgy), Heat, Nucleate boiling, Refrigerants
Proceedings Papers

Studies on Condensation of Refrigerants in a High Aspect Ratio Microchannel and in a Novel Micro-Groove Surface Heat Exchanger: Development of Micro-Condensers in Compact Two Phase Cooling Systems

Serguei Dessiatoun, Sourav Chowdhury, Ebrahim Al-Hajri, Edvin Cetegen, Michael Ohadi
Proc. ASME. ICNMM2007, ASME 5th International Conference on Nanochannels, Microchannels, and Minichannels, 109-116, June 18–20, 2007
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2007-30179
https://doi.org/10.1115/ICNMM2007-30179
View Paper titled, Studies on Condensation of Refrigerants in a High Aspect Ratio Microchannel and in a Novel Micro-Groove Surface Heat Exchanger: Development of Micro-Condensers in Compact Two Phase Cooling Systems
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Topics: Condensation, Condensers (steam plant), Cooling systems, Heat exchangers, Microchannels, Refrigerants, Heat transfer coefficients, Pressure drop, Temperature, Fluids
Proceedings Papers

Heat Transfer Analysis of Microgrooved Evaporator and Condenser Surfaces Utilized in a High Heat Flux Two-Phase Flow Loop

Edvin Cetegen, Thomas Baummer, Serguei Dessiatoun, Michael Ohadi
Proc. ASME. IMECE2007, Volume 8: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A and B, 1031-1037, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-42001
https://doi.org/10.1115/IMECE2007-42001
View Paper titled, Heat Transfer Analysis of Microgrooved Evaporator and Condenser Surfaces Utilized in a High Heat Flux Two-Phase Flow Loop
Open the PDF for Heat Transfer Analysis of Microgrooved Evaporator and Condenser Surfaces Utilized in a High Heat Flux Two-Phase Flow Loop in another window
Topics: Condensers (steam plant), Heat flux, Heat transfer, Two-phase flow, Pressure drop, Cooling, Heat, Heat transfer coefficients, Condensation, Electronic components