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Proceedings Papers

Thermal Management in Direct Chip Attach Assemblies

Daniel F. Baldwin, James T. Beerensson, Suresh K. Sitaraman
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 29-37, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0887
https://doi.org/10.1115/IMECE1996-0887
View Paper titled, Thermal Management in Direct Chip Attach Assemblies
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Topics: Thermal management, Adhesives, Electronics, Anisotropy, Design, Energy dissipation, Flip-chip, Flip-chip assemblies, Flip-chip devices, Junctions
Proceedings Papers

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Prema Palaniappan, Daniel F. Baldwin
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1221
https://doi.org/10.1115/IMECE1997-1221
View Paper titled, In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure
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Topics: Density, Electronics, Flip-chip, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture (Process), Glass transition, Manufacturing, Printed circuit boards
Proceedings Papers

Manufacturability of Underfill Processing for Low Cost Flip Chip

Daniel F. Baldwin, Nathan W. Pascarella
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 21-31, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0812
https://doi.org/10.1115/IMECE1997-0812
View Paper titled, Manufacturability of Underfill Processing for Low Cost Flip Chip
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Topics: Flip-chip, Flip-chip devices, Flow (Dynamics), Compression, Electronics, Manufacturing, Printed circuit boards, Reliability, Semiconductor devices, Surface mount packaging
Proceedings Papers

Preliminary in Process Stress Analysis of Flip Chip Assemblies During Thermal Cycling

Prema Palaniappan, Daniel F. Baldwin
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 101-106, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0435
https://doi.org/10.1115/IMECE1998-0435
View Paper titled, Preliminary in Process Stress Analysis of Flip Chip Assemblies During Thermal Cycling
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Topics: Flip-chip assemblies, Stress analysis (Engineering), Stress, Reliability, Cycles, Accelerated life testing, Electronic packages, Failure, Manufacturing, Simulation models
Proceedings Papers

Analysis of Process Yield in Low Cost Flip Chip on Board Assembly Processes

Ryan Thorpe, Lawrence P. McGovern, Daniel F. Baldwin
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 27-33, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0425
https://doi.org/10.1115/IMECE1998-0425
View Paper titled, Analysis of Process Yield in Low Cost Flip Chip on Board Assembly Processes
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Topics: Flip-chip, Flip-chip devices, Manufacturing, Flow (Dynamics), Solders, Vehicles, Compression, Ovens, Printing
Proceedings Papers

Reliability Analysis of Flip Chip on Board Assemblies Using No-Flow Underfill Materials

Ryan Thorpe, Daniel F. Baldwin
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 33-38, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0914
https://doi.org/10.1115/IMECE1999-0914
View Paper titled, Reliability Analysis of Flip Chip on Board Assemblies Using No-Flow Underfill Materials
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Topics: Event history analysis, Flip-chip, Flip-chip devices, Flow (Dynamics), Reliability
Proceedings Papers

Fundamental Analyses of Smart Tooling for Assembly of Thin Flexible Circuit and Board Systems

Ruijun Chen, Daniel F. Baldwin
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 53-58, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0917
https://doi.org/10.1115/IMECE1999-0917
View Paper titled, Fundamental Analyses of Smart Tooling for Assembly of Thin Flexible Circuit and Board Systems
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Topics: Circuits, Manufacturing, Tooling, Fixturing, Printed circuit boards, Design, Flexible electronics, Lumber, Printing, Reflow soldering
Proceedings Papers

High Density Through-Wafer Electrical Interconnects for Direct-Chip-Attach, Device-Scale MEMS Packaging

Jordan Neysmith, Daniel F. Baldwin
Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 595-599, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1151
https://doi.org/10.1115/IMECE2000-1151
View Paper titled, High Density Through-Wafer Electrical Interconnects for Direct-Chip-Attach, Device-Scale MEMS Packaging
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Topics: Density, MEMS packaging, Semiconductor wafers, Solders, Complementary metal oxide semiconductors, Manufacturing, Metallurgy, Signals
Journal Articles

Heterogeneous Void Nucleation Study in Flip Chip Assembly Process Using No-Flow Underfill

Sangil Lee, Daniel F. Baldwin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011005.
Paper No: EP-12-1068
https://doi.org/10.1115/1.4026164
Published Online: December 31, 2013
View Article titled, Heterogeneous Void Nucleation Study in Flip Chip Assembly Process Using No-Flow Underfill
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Topics: Flow (Dynamics), Nucleation (Physics), Temperature, Manufacturing, Solders
Journal Articles

Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous Fluid

Brett Fennell, Sangil Lee, Daniel F. Baldwin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041013.
https://doi.org/10.1115/1.4002825
Published Online: December 8, 2010
View Article titled, Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous Fluid
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Topics: Flip-chip devices, Flow (Dynamics), Solders, Modeling, Springs, Surface tension, Viscosity, Fluids, Dampers
Proceedings Papers

Effect of Reflow Parameters on Solder Wetting

Suk Chae Kang, Daniel F. Baldwin
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 177-182, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35193
https://doi.org/10.1115/IPACK2003-35193
View Paper titled, Effect of Reflow Parameters on Solder Wetting
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Topics: Solders, Wetting, Temperature, Constitutive equations, Cooling, Dynamics (Mechanics), Electronics, Manufacturing, Metals, Temperature profiles
Journal Articles

Displacement Theory for Fixturing Design of Thin Flexible Circuit Board Assembly

Ruijun Chen, Assoc. Mem. ASME, Daniel F. Baldwin, Assoc. Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 388–393.
https://doi.org/10.1115/1.1371926
Published Online: November 1, 2000
View Article titled, Displacement Theory for Fixturing Design of Thin Flexible Circuit Board Assembly
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Topics: Displacement, Fixturing, Manufacturing, Deflection, Stress, Plate theory
Journal Articles

The Role of Gas Dissolution and Induced Crystallization During Microcellular Polymer Processing: A Study of Poly (Ethylene Terephthalate) and Carbon Dioxide Systems

Daniel F. Baldwin, Minuro Shimbo, Nam P. Suh
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. January 1995, 117(1): 62–74.
https://doi.org/10.1115/1.2804373
Published Online: January 1, 1995
View Article titled, The Role of Gas Dissolution and Induced Crystallization During Microcellular Polymer Processing: A Study of Poly (Ethylene Terephthalate) and Carbon Dioxide Systems
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Topics: Carbon dioxide, Crystallization, Polymers, Nucleation (Physics), Stiffness, Carbon, Diffusion (Physics), Experimental characterization, High pressure (Physics), High temperature