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Journal Articles

Hygrothermal Behavior of Advanced Polymers Above Water Boiling Temperatures

Changsoo Jang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011013.
Paper No: EP-13-1091
https://doi.org/10.1115/1.4026626
Published Online: February 18, 2014
View Article titled, Hygrothermal Behavior of Advanced Polymers Above Water Boiling Temperatures
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Topics: Boiling, Polymers, Temperature, Water, Weight (Mass), Glass transition, Absorption
Proceedings Papers

Failure Analysis of Contact Probe Pins for SnPb and Sn Applications

Changsoo Jang, Seungbae Park, Bill Infantolino, Lawrence Lehman, Ryan Morgan, Dipak Sengupta
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 31-36, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33214
https://doi.org/10.1115/IPACK2007-33214
View Paper titled, Failure Analysis of Contact Probe Pins for SnPb and Sn Applications
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Topics: Failure analysis, Pins (Engineering), Probes, Tin, Failure, Inspection, Wear, Contact resistance, Failure mechanisms, Surface roughness
Proceedings Papers

Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem

Changsoo Jang, Bongtae Han, Seungbae Park, Samson Yoon
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 749-755, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33142
https://doi.org/10.1115/IPACK2007-33142
View Paper titled, Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem
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Topics: Diffusion (Physics), Microelectronic devices, Temperature
Proceedings Papers

A Hybrid Approach to Investigate Effect of Flip-Chip Packaging on RF MEMS Devices Performance

Li Sun, Shawn Cunningham, Art Morris, Changsoo Jang, Bongtae Han
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 205-211, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-67452
https://doi.org/10.1115/IMECE2008-67452
View Paper titled, A Hybrid Approach to Investigate Effect of Flip-Chip Packaging on RF MEMS Devices Performance
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Topics: Flip-chip, Microelectromechanical systems, Packaging, Finite element analysis, Warping, Capacitance, Computer simulation, Design, Displacement, Interferometry
Proceedings Papers

An Advanced Real-Time Moire´ Interferometry System With Conductive Heating/Cooling and Its Application on a Creep Behavior of Solder

Seungmin Cho, Changsoo Jang, Bongtae Han
Proc. ASME. IMECE2007, Volume 10: Mechanics of Solids and Structures, Parts A and B, 479-487, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-43698
https://doi.org/10.1115/IMECE2007-43698
View Paper titled, An Advanced Real-Time Moire´ Interferometry System With Conductive Heating/Cooling and Its Application on a Creep Behavior of Solder
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Topics: Cooling, Creep, Heating, Interferometry, Solders, Solder joints, Constitutive equations, Convection, Cycles, Deformation
Proceedings Papers

Experimental Verification of Water Ingress in a Void by Quick Diffusion at High Reflow Temperature

Seungbae Park, Haojun Zhang, Changsoo Jang
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 1-8, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-42079
https://doi.org/10.1115/IMECE2007-42079
View Paper titled, Experimental Verification of Water Ingress in a Void by Quick Diffusion at High Reflow Temperature
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Topics: Diffusion (Physics), Electronic packages, Temperature, Water, Vapor pressure, Cavities, Failure, High temperature, Pressure sensors, Computer simulation
Journal Articles

Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation

S. B. Park, Chirag Shah, Jae B. Kwak, Changsoo Jang, Soonwan Chung, James M. Pitarresi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2008, 130(4): 044502.
https://doi.org/10.1115/1.3000097
Published Online: November 17, 2008
View Article titled, Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation
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Topics: Accelerometers, Deformation, Dynamic response, Printed circuit boards, Strain gages, Transients (Dynamics), Lumber, Displacement
Journal Articles

Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading

Samson Yoon, Changsoo Jang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2008, 130(2): 024502.
https://doi.org/10.1115/1.2912181
Published Online: May 14, 2008
View Article titled, Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading
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Topics: Diffusion (Physics), Finite element analysis, Heat transfer, Modeling, Semiconductors (Materials), Stress, Stress analysis (Engineering), Temperature, Deformation, Thermal expansion
Proceedings Papers

Issues in Assembly Process of Fine Pitch Chip-on-Flex Packages for LCD Applications

Changsoo Jang, Seongyoung Han, Jay Ryu, Hangyu Kim
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 131-138, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-59155
https://doi.org/10.1115/IMECE2004-59155
View Paper titled, Issues in Assembly Process of Fine Pitch Chip-on-Flex Packages for LCD Applications
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Topics: Manufacturing, Bonding, Adhesives, Lasers, Anisotropy, Testing
Journal Articles

Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem

Changsoo Jang, Seungbae Park, Bongtae Han, Samson Yoon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011004.
https://doi.org/10.1115/1.2837521
Published Online: January 31, 2008
View Article titled, Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem
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Topics: Diffusion (Physics), Temperature, Transients (Dynamics), Finite difference methods
Proceedings Papers

On Water Behavior Inside and Around a Void at Polymer Interface

Changsoo Jang, Seungbae Park
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 467-477, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-16255
https://doi.org/10.1115/IMECE2006-16255
View Paper titled, On Water Behavior Inside and Around a Void at Polymer Interface
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Topics: Polymers, Water, Vapor pressure, Diffusion (Physics), Adhesion, Boiling, Condensation, Crack propagation, Delamination, Electronic packages