Page 1 | Search Results | ASME Digital Collection

1-9 of 9

Sort by

Sort Order Select

Journal Articles

Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 2—Verification and Application

C. Basaran, C. S. Desai, T. Kundu

Publisher: ASME

J. Electron. Packag. March 1998, 120(1): 48–53.

https://doi.org/10.1115/1.2792285

Published Online: March 1, 1998

View Article titled, Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 2—Verification and Application

Topics: Electronic packaging, Finite element analysis, Thermomechanics, Alloys, Solders, Modeling, Surface mount technology

Journal Articles

Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 1—Theory and Formulation

C. Basaran, C. S. Desai, T. Kundu

Publisher: ASME

J. Electron. Packag. March 1998, 120(1): 41–47.

https://doi.org/10.1115/1.2792284

Published Online: March 1, 1998

View Article titled, Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 1—Theory and Formulation

Topics: Electronic packaging, Finite element analysis, Thermomechanics, Constitutive equations, Cycles, Damage, Deformation, Design, Failure, Semiconductor devices

Journal Articles

Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part I—Unified Constitutive Model and Calibration

C. S. Desai, J. Chia, T. Kundu, J. L. Prince

Publisher: ASME

J. Electron. Packag. December 1997, 119(4): 294–300.

https://doi.org/10.1115/1.2792252

Published Online: December 1, 1997

View Article titled, Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part I—Unified Constitutive Model and Calibration

Topics: Calibration, Constitutive equations, Electronic packaging, Thermomechanics, Failure, Creep, Damage, Design, Fatigue, Fatigue failure

Journal Articles

Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part II—Unified Constitutive Models, Validation, and Design

C. S. Desai, J. Chia, T. Kundu, J. L. Prince

Publisher: ASME

J. Electron. Packag. December 1997, 119(4): 301–309.

https://doi.org/10.1115/1.2792253

Published Online: December 1, 1997

View Article titled, Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part II—Unified Constitutive Models, Validation, and Design

Topics: Constitutive equations, Design, Electronic packaging, Thermomechanics, Failure, Fatigue, Fatigue failure, Modeling, Solders, Stress

Journal Articles

Detection of Delamination Cracks in Layered Fiber-Reinforced Composite Plates

M. R. Karim, T. Kundu, C. S. Desai

Publisher: ASME

J. Pressure Vessel Technol. May 1989, 111(2): 165–171.

https://doi.org/10.1115/1.3265653

Published Online: May 1, 1989

View Article titled, Detection of Delamination Cracks in Layered Fiber-Reinforced Composite Plates

Topics: Delamination, Fiber reinforced composites, Fracture (Materials), Plates (structures), Composite materials, Damage, Displacement, Dynamic response, Fast Fourier transforms, Integral equations

Journal Articles

Proceedings, International Conference on Constitutive Laws for Engineering Materials, Theory and Application

C. S. Desai, Editor, R. H. Gallagher, Editor, L. B. Freund, Reviewer

Publisher: ASME

J. Appl. Mech. September 1983, 50(3): 703–704.

https://doi.org/10.1115/1.3167128

Published Online: September 1, 1983

View Article titled, Proceedings, International Conference on Constitutive Laws for Engineering Materials, Theory and Application

Topics: Constitutive equations

Journal Articles

Elementary Finite Element Method

C. S. Desai, Author, S. Kelsey, Reviewer

Publisher: ASME

J. Appl. Mech. December 1982, 49(4): 932.

https://doi.org/10.1115/1.3162676

Published Online: December 1, 1982

View Article titled, Elementary Finite Element Method

Topics: Finite element methods

Journal Articles

Elementary Finite Element Method

C. S. Desai, Author, H. Saunders, Reviewer

Publisher: ASME

J. Mech. Des. October 1981, 103(4): 685.

https://doi.org/10.1115/1.3254971

Published Online: October 1, 1981

View Article titled, Elementary Finite Element Method

Topics: Finite element methods

Journal Articles

Introduction to the Finite-Element Method

C. S. Desai, Author, J. F. Abel, Author, P. V. Marcal, Reviewer

Publisher: ASME

J. Appl. Mech. June 1973, 40(2): 404.

https://doi.org/10.1115/1.3422995

Published Online: June 1, 1973

View Article titled, Introduction to the Finite-Element Method

Topics: Finite element methods

Journal citation

NARROW

Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 2—Verification and Application

Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 1—Theory and Formulation

Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part I—Unified Constitutive Model and Calibration

Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part II—Unified Constitutive Models, Validation, and Design

Detection of Delamination Cracks in Layered Fiber-Reinforced Composite Plates

Proceedings, International Conference on Constitutive Laws for Engineering Materials, Theory and Application

Elementary Finite Element Method

Elementary Finite Element Method

Introduction to the Finite-Element Method

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only