1-20 of 75
C Cheng
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Computer Simulations for Frontal Impact

Jiamaw Doong, James C. Cheng
Proc. ASME. CIE94, ASME 1994 International Computers in Engineering Conference and Exhibition, 597-605, September 11–14, 1994
Publisher: American Society of Mechanical Engineers
Paper No: CIE1994-0449
https://doi.org/10.1115/CIE1994-0449
View Paper titled, Computer Simulations for Frontal Impact
Open the PDF for Computer Simulations for Frontal Impact in another window
Topics: Computer simulation, Vehicles, Impact testing, Wounds, Deformation, Automotive design, Design, Finite element analysis, Regulations, Safety
Proceedings Papers

Challenge Face by Truck Frontal Crash Analysis

James C. Cheng, Jialiang Le
Proc. ASME. CIE94, ASME 1994 International Computers in Engineering Conference and Exhibition, 607-613, September 11–14, 1994
Publisher: American Society of Mechanical Engineers
Paper No: CIE1994-0450
https://doi.org/10.1115/CIE1994-0450
View Paper titled, Challenge Face by Truck Frontal Crash Analysis
Open the PDF for Challenge Face by Truck Frontal Crash Analysis in another window
Topics: Computer-aided engineering, Cycles, Design, Engineering prototypes, Finite element model, Light trucks, Springs, Testing, Trucks, Vehicles
Proceedings Papers

Crash/Crush Analysis of Vehicle Structures Utilizing Thin-Walled Beam Elements

Xiaodong Tang, James C. Cheng
Proc. ASME. DETC97, Volume 5: 17th Computers in Engineering Conference, V005T32A062, September 14–17, 1997
Publisher: American Society of Mechanical Engineers
Paper No: DETC97/CIE-4454
https://doi.org/10.1115/DETC97/CIE-4454
View Paper titled, Crash/Crush Analysis of Vehicle Structures Utilizing Thin-Walled Beam Elements
Open the PDF for Crash/Crush Analysis of Vehicle Structures Utilizing Thin-Walled Beam Elements in another window
Topics: Vehicles, Buckling, Deformation, Finite element analysis, Hinges, Computer software, Design, Plates (structures), Approximation, Displacement
Journal Articles

Effect of Aluminum Content on Interfacial Reaction of Directionally Solidified TiAl Alloys

C. Cheng, Y. Sui, K. Feng, J. Qi, Y. He, Q. Meng, F. Wei, Z. Sun
Journal: Journal of Testing and Evaluation
Publisher: ASTM International
Article Type: Technical Papers
J. Test. Eval.. March 2018, 46(2): 764–771.
Paper No: JTE20160307
https://doi.org/10.1520/JTE20160307
Published Online: March 1, 2018
View Article titled, Effect of Aluminum Content on Interfacial Reaction of Directionally Solidified TiAl Alloys
Open the PDF for Effect of Aluminum Content on Interfacial Reaction of Directionally Solidified TiAl Alloys in another window
Proceedings Papers

Design Optimization of Beams With Multi-Layers of Corrugations

W. N. Cheng, C. C. Cheng
Proc. ASME. IDETC-CIE2015, Volume 8: 27th Conference on Mechanical Vibration and Noise, V008T13A012, August 2–5, 2015
Publisher: American Society of Mechanical Engineers
Paper No: DETC2015-46197
https://doi.org/10.1115/DETC2015-46197
View Paper titled, Design Optimization of Beams With Multi-Layers of Corrugations
Open the PDF for Design Optimization of Beams With Multi-Layers of Corrugations in another window
Topics: Design, Optimization, Finite element methods, Modeling, Dynamic response, Equilibrium (Physics)
Proceedings Papers

A Model to Guide Template-Based Nanoparticle Printing Development

David A. Rolfe, Kristen L. Dorsey, Jim C. Cheng, Albert P. Pisano
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48449
https://doi.org/10.1115/IPACK2015-48449
View Paper titled, A Model to Guide Template-Based Nanoparticle Printing Development
Open the PDF for A Model to Guide Template-Based Nanoparticle Printing Development in another window
Topics: Nanoparticles, Printing, Inks, Sorption, Fluid dynamics, Fluids, Molding, Vapors, Diffusion (Physics), Engineering simulation
Journal Articles

Quantitative Analysis of the Nonlinear Displacement–Load Behavior of the Lumbar Spine

Andrew D. Hanlon, Daniel J. Cook, Matthew S. Yeager, Boyle C. Cheng
Journal: Journal of Biomechanical Engineering
Publisher: ASME
Article Type: Research-Article
J Biomech Eng. August 2014, 136(8): 081009.
Paper No: BIO-13-1313
https://doi.org/10.1115/1.4027754
Published Online: June 11, 2014
View Article titled, Quantitative Analysis of the Nonlinear Displacement–Load Behavior of the Lumbar Spine
Open the PDF for Quantitative Analysis of the Nonlinear Displacement–Load Behavior of the Lumbar Spine in another window
Topics: Displacement, Lumbar spine, Stress, Stability, Splines, Fittings, Testing
Proceedings Papers

Initial Observations in the Validation of a Hybrid Test Protocol for Motion Preservation Devices on a Biomechanical Spine Tester

Boyle C. Cheng, William C. Welch
Proc. ASME. SBC2008, ASME 2008 Summer Bioengineering Conference, Parts A and B, 107-108, June 25–29, 2008
Publisher: American Society of Mechanical Engineers
Paper No: SBC2008-192467
https://doi.org/10.1115/SBC2008-192467
View Paper titled, Initial Observations in the Validation of a Hybrid Test Protocol for Motion Preservation Devices on a Biomechanical Spine Tester
Open the PDF for Initial Observations in the Validation of a Hybrid Test Protocol for Motion Preservation Devices on a Biomechanical Spine Tester in another window
Topics: Biomechanics, Preservation, Cervical spine, Diseases, Evaluation methods
Proceedings Papers

Techniques Beyond Range of Motion for Analyzing Spinal Instrumentation Utilizing a CT Based Specimen Specific Solid Model

Boyle C. Cheng, Daniel J. Cook, Mithulan Jegapragasan, Mathieu Cuchanski, Avinash Patwardhan
Proc. ASME. SBC2009, ASME 2009 Summer Bioengineering Conference, Parts A and B, 1255-1256, June 17–21, 2009
Publisher: American Society of Mechanical Engineers
Paper No: SBC2009-206777
https://doi.org/10.1115/SBC2009-206777
View Paper titled, Techniques Beyond Range of Motion for Analyzing Spinal Instrumentation Utilizing a CT Based Specimen Specific Solid Model
Open the PDF for Techniques Beyond Range of Motion for Analyzing Spinal Instrumentation Utilizing a CT Based Specimen Specific Solid Model in another window
Topics: Instrumentation, Solid models, Preservation, Biomechanics, Design, Stress, Testing
Proceedings Papers

Combinations of Biomechanical Metrics Involving Single and Multi Level Lumbar Posterior Dynamic Spinal Treatments

Boyle C. Cheng, Daniel J. Cook, Matt Yeager, Bin Lu, Donald M. Whiting
Proc. ASME. SBC2012, ASME 2012 Summer Bioengineering Conference, Parts A and B, 1077-1078, June 20–23, 2012
Publisher: American Society of Mechanical Engineers
Paper No: SBC2012-80061
https://doi.org/10.1115/SBC2012-80061
View Paper titled, Combinations of Biomechanical Metrics Involving Single and Multi Level Lumbar Posterior Dynamic Spinal Treatments
Open the PDF for Combinations of Biomechanical Metrics Involving Single and Multi Level Lumbar Posterior Dynamic Spinal Treatments in another window
Topics: Biomechanics, Biological tissues, Displacement, Dynamic systems, Lumbar spine, Preservation
Proceedings Papers

Precision of a Novel Vertebral Motion Analysis System: Preliminary Results

Matthew S. Yeager, Daniel J. Cook, Boyle C. Cheng
Proc. ASME. SBC2012, ASME 2012 Summer Bioengineering Conference, Parts A and B, 1125-1126, June 20–23, 2012
Publisher: American Society of Mechanical Engineers
Paper No: SBC2012-80873
https://doi.org/10.1115/SBC2012-80873
View Paper titled, Precision of a Novel Vertebral Motion Analysis System: Preliminary Results
Open the PDF for Precision of a Novel Vertebral Motion Analysis System: Preliminary Results in another window
Topics: Bone, Computerized tomography, Gravity (Force), Imaging, Magnetic resonance imaging, Muscle, Soft tissues, X-rays
Proceedings Papers

Facet Translation Analysis in the Lumbar Spine: An Application in Posterior Dynamic Stabilization

Daniel J. Cook, Matthew S. Yeager, Boyle C. Cheng
Proc. ASME. SBC2012, ASME 2012 Summer Bioengineering Conference, Parts A and B, 1095-1096, June 20–23, 2012
Publisher: American Society of Mechanical Engineers
Paper No: SBC2012-80319
https://doi.org/10.1115/SBC2012-80319
View Paper titled, Facet Translation Analysis in the Lumbar Spine: An Application in Posterior Dynamic Stabilization
Open the PDF for Facet Translation Analysis in the Lumbar Spine: An Application in Posterior Dynamic Stabilization in another window
Topics: Lumbar spine, Diseases, Disks, Rotation, Surgery
Proceedings Papers

Analyzing the Hysteresis of the Lumbar Spine

Andrew D. Hanlon, Daniel J. Cook, Matthew S. Yeager, Boyle C. Cheng
Proc. ASME. SBC2012, ASME 2012 Summer Bioengineering Conference, Parts A and B, 1097-1098, June 20–23, 2012
Publisher: American Society of Mechanical Engineers
Paper No: SBC2012-80325
https://doi.org/10.1115/SBC2012-80325
View Paper titled, Analyzing the Hysteresis of the Lumbar Spine
Open the PDF for Analyzing the Hysteresis of the Lumbar Spine in another window
Topics: Cycles, Displacement, Lumbar spine, Machinery, Spine mechanics, Stress, Testing
Proceedings Papers

Development of a Solid Model Based Method for Investigating Facet Articulation

Daniel J. Cook, Boyle C. Cheng, Mithulan Jegapragasan, Mathieu Cuchanski
Proc. ASME. SBC2009, ASME 2009 Summer Bioengineering Conference, Parts A and B, 861-862, June 17–21, 2009
Publisher: American Society of Mechanical Engineers
Paper No: SBC2009-206827
https://doi.org/10.1115/SBC2009-206827
View Paper titled, Development of a Solid Model Based Method for Investigating Facet Articulation
Open the PDF for Development of a Solid Model Based Method for Investigating Facet Articulation in another window
Topics: Solid models
Proceedings Papers

Comparison of Mechanical Characteristics of Deployment for Expandable vs. Fixed Interbody Cages: Implications for Premature Clinical Failures

Liu C. Cheng, Jovauna M. Currey, Ashin Modak, Hyun Kyu Han, R. Trigg McClellan, Murat Pekmezci, Jenni M. Buckley, Christopher P. Ames
Proc. ASME. SBC2010, ASME 2010 Summer Bioengineering Conference, Parts A and B, 483-484, June 16–19, 2010
Publisher: American Society of Mechanical Engineers
Paper No: SBC2010-19129
https://doi.org/10.1115/SBC2010-19129
View Paper titled, Comparison of Mechanical Characteristics of Deployment for Expandable vs. Fixed Interbody Cages: Implications for Premature Clinical Failures
Open the PDF for Comparison of Mechanical Characteristics of Deployment for Expandable vs. Fixed Interbody Cages: Implications for Premature Clinical Failures in another window
Topics: Cutting, Design, Failure, Mechanical properties, Press fits, Stress
Proceedings Papers

Integrating Coherent Porous Silicon as a Wicking Structure in the MEMS Based Fabrication of a Vertically Wicking Micro-Columnated Loop Heat Pipe

Navdeep S. Dhillon, Chris Hogue, Matthew W. Chan, Jim C. Cheng, Albert P. Pisano
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 297-306, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-64676
https://doi.org/10.1115/IMECE2011-64676
View Paper titled, Integrating Coherent Porous Silicon as a Wicking Structure in the MEMS Based Fabrication of a Vertically Wicking Micro-Columnated Loop Heat Pipe
Open the PDF for Integrating Coherent Porous Silicon as a Wicking Structure in the MEMS Based Fabrication of a Vertically Wicking Micro-Columnated Loop Heat Pipe in another window
Topics: Heat pipes, Manufacturing, Microelectromechanical systems, Silicon, Semiconductor wafers, Etching, Evaporation, Thin films, Design, Condensers (steam plant)
Proceedings Papers

Heat Transfer due to Microscale Thin Film Evaporation From the Steady State Meniscus in a Coherent Porous Silicon Based Micro-Columnated Wicking Structure

Navdeep S. Dhillon, Jim C. Cheng, Albert P. Pisano
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 667-677, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-65057
https://doi.org/10.1115/IMECE2011-65057
View Paper titled, Heat Transfer due to Microscale Thin Film Evaporation From the Steady State Meniscus in a Coherent Porous Silicon Based Micro-Columnated Wicking Structure
Open the PDF for Heat Transfer due to Microscale Thin Film Evaporation From the Steady State Meniscus in a Coherent Porous Silicon Based Micro-Columnated Wicking Structure in another window
Topics: Evaporation, Heat transfer, Microscale devices, Silicon, Steady state, Thin films, Vapors, Algorithms, Design, Fluid dynamics
Proceedings Papers

Minimizing the Wick Thickness in a Planar Microscale Loop Heat Pipe Using Efficient Thermodynamic Design

Navdeep S. Dhillon, Jim C. Cheng, Albert P. Pisano
Proc. ASME. IMECE2011, Volume 6: Fluids and Thermal Systems; Advances for Process Industries, Parts A and B, 1121-1129, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-64698
https://doi.org/10.1115/IMECE2011-64698
View Paper titled, Minimizing the Wick Thickness in a Planar Microscale Loop Heat Pipe Using Efficient Thermodynamic Design
Open the PDF for Minimizing the Wick Thickness in a Planar Microscale Loop Heat Pipe Using Efficient Thermodynamic Design in another window
Topics: Design, Heat pipes, Microscale devices, Flow (Dynamics), Heat, Finite element analysis, Fluids, Heat conduction, Leakage, Microfabrication
Proceedings Papers

Device Packaging Techniques for Implementing a Novel Thermal Flux Method for Fluid Degassing and Charging of a Planar Microscale Loop Heat Pipe

Navdeep S. Dhillon, Jim C. Cheng, Albert P. Pisano
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 963-971, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-64944
https://doi.org/10.1115/IMECE2011-64944
View Paper titled, Device Packaging Techniques for Implementing a Novel Thermal Flux Method for Fluid Degassing and Charging of a Planar Microscale Loop Heat Pipe
Open the PDF for Device Packaging Techniques for Implementing a Novel Thermal Flux Method for Fluid Degassing and Charging of a Planar Microscale Loop Heat Pipe in another window
Topics: Fluids, Heat flux, Heat pipes, Microscale devices, Packaging, Microelectromechanical systems, Semiconductor wafers, Aluminum, Bonding, Borosilicate glasses
Proceedings Papers

On the Friction Coefficient in the Numerical Simulation of Tidal Wave Propagation

Z. Y. Song, C. Cheng, F. M. Xu, J. Kong
Proc. ASME. IMECE2010, Volume 11: New Developments in Simulation Methods and Software for Engineering Applications; Safety Engineering, Risk Analysis and Reliability Methods; Transportation Systems, 181-186, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40275
https://doi.org/10.1115/IMECE2010-40275
View Paper titled, On the Friction Coefficient in the Numerical Simulation of Tidal Wave Propagation
Open the PDF for On the Friction Coefficient in the Numerical Simulation of Tidal Wave Propagation in another window
Topics: Computer simulation, Friction, Tides, Wave propagation, Energy dissipation, Waves, Accuracy and precision, Damping, Stability, Theoretical analysis