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Berend Denkena
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Proceedings Papers

Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 247-254, August 30–September 2, 2009
Publisher: American Society of Mechanical Engineers
Paper No: DETC2009-86658