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Arun Gowda
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Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021105.
Paper No: EP-21-1012
https://doi.org/10.1115/1.4052071
Published Online: September 24, 2021
View Article titled, A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics
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Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat
Journal Articles

A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor Devices

Liang Yin, Christopher Kapusta, Arun Gowda, Kaustubh Nagarkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031009.
Paper No: EP-17-1113
https://doi.org/10.1115/1.4040499
Published Online: July 2, 2018
View Article titled, A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor Devices
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Topics: Overlays (Materials engineering), Packaging, Power semiconductor devices, Reliability, Silicon, Wire, Gates (Closures), Manufacturing, Temperature, Heat sinks
Proceedings Papers

Double-Sided Microchannel Cooling of a Power Electronics Module Using Power Overlay

Adam G. Pautsch, Arun Gowda, Ljubisa Stevanovic, Rich Beaupre
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 427-436, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89190
https://doi.org/10.1115/InterPACK2009-89190
View Paper titled, Double-Sided Microchannel Cooling of a Power Electronics Module Using Power Overlay
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Topics: Cooling, Electronics, Microchannels, Overlays (Materials engineering), Heat exchangers, Heat sinks, Contact resistance, Design, Heat transfer, Silicon
Proceedings Papers

Thermal Resistance of Bond-Lines Formed With Composite Thermal Interface Materials

Gary Lehmann, Hao Zhang, Arun Gowda, David Esler
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 503-509, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73380
https://doi.org/10.1115/IPACK2005-73380
View Paper titled, Thermal Resistance of Bond-Lines Formed With Composite Thermal Interface Materials
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Topics: Composite materials, Particle size, Thermal conductivity, Thermal resistance, Particulate matter, Electrical conductance, Adhesives, Lasers, Manufacturing, Modeling
Proceedings Papers

Thermal and Mechanical Properties of Silicone Thermal Interface Materials With Varying Cross-Link Densities

Arun Gowda, Annita Zhong, Sandeep Tonapi, Kaustubh Nagarkar, K. Srihari
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1911-1918, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73490
https://doi.org/10.1115/IPACK2005-73490
View Paper titled, Thermal and Mechanical Properties of Silicone Thermal Interface Materials With Varying Cross-Link Densities
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Topics: Mechanical properties, Silicones, Heat, Adhesives, Fillers (Materials), Flat heat pipes, Microelectronic devices, Phase change materials, Pumps, Resins
Proceedings Papers

Site Redressing Techniques and Rework of Lead-Free Chip Scale Packages

Arun Gowda, Anthony Primavera, K. Srihari
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 523-531, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-55637
https://doi.org/10.1115/IMECE2003-55637
View Paper titled, Site Redressing Techniques and Rework of Lead-Free Chip Scale Packages
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Topics: Cycles, Electronics, Lead-free solders, Manufacturing, Printed circuit boards, Solders, Temperature
Journal Articles

Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems

Arun Gowda, David Esler, Sandeep Tonapi, Annita Zhong, K. Srihari, Florian Schattenmann
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 130–136.
https://doi.org/10.1115/1.2188952
Published Online: February 14, 2006
View Article titled, Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems
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Topics: Acoustics, Adhesives, Aluminum, Computerized tomography, Contact resistance, Fillers (Materials), Magnification, Microscopy, Scanning electron microscopy, Silicon