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Ali Shakouri
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Proceedings Papers
Xihui Wang, Ajanta Saha, Ye Mi, Ali Shakouri, Muhammad Ashraful Alam, George T. C. Chiu, Jan P. Allebach
Proc. ASME. MSEC2022, Volume 2: Manufacturing Processes; Manufacturing Systems, V002T06A021, June 27–July 1, 2022
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2022-85638
Proceedings Papers
Proc. ASME. MSEC2022, Volume 2: Manufacturing Processes; Manufacturing Systems, V002T06A019, June 27–July 1, 2022
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2022-85553
Proceedings Papers
Ajanta Saha, Sarath Gopalakrishnan, Jose Waimin, Sotoudeh Sedaghat, Ye Mi, Nicholas Glassmaker, Mukkerem Cakmak, Ali Shakouri, Rahim Rahimi, Muhammad A. Alam
Proc. ASME. MSEC2022, Volume 2: Manufacturing Processes; Manufacturing Systems, V002T06A007, June 27–July 1, 2022
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2022-84878
Proceedings Papers
S. Chandra Mouli, Sotoudeh Sedaghat, Muhammed Ramazan Oduncu, Ajanta Saha, Rahim Rahimi, Muhammad A. Alam, Alexander Wei, Ali Shakouri, Bruno Ribeiro
Proc. ASME. MSEC2022, Volume 2: Manufacturing Processes; Manufacturing Systems, V002T06A015, June 27–July 1, 2022
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2022-85392
Proceedings Papers
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 219-222, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24396
Proceedings Papers
Kwong-Luck Tan, Andrew Miner, Xiaofeng Fan, Chris LaBounty, Gehong Zheng, John E. Bowers, Edward T. Croke, Ali Shakouri, Arun Majumdar
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 193-197, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24393
Proceedings Papers
Scott T. Huxtable, Alexis R. Abramson, Arun Majumdar, Chang-Lin Tien, Chris LaBounty, Xiaofeng Fan, Gehong Zeng, John E. Bowers, Ali Shakouri, Edward T. Croke
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 223-229, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24397
Proceedings Papers
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 231-235, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24398
Proceedings Papers
Proc. ASME. IMECE2000, Heat Transfer: Volume 2, 339-343, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1445
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A008, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6413
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A080, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48682
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. September 2015, 137(9): 091012.
Paper No: HT-14-1229
Published Online: May 14, 2015
Proceedings Papers
Lars Houbak-Jensen, Anders Holten, Morten Boje Blarke, Eckhard A. Groll, Ali Shakouri, Kazuaki Yazawa
Proc. ASME. IMECE2013, Volume 8B: Heat Transfer and Thermal Engineering, V08BT09A039, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-62894
Proceedings Papers
Proc. ASME. MNHMT2013, ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer, V001T06A004, December 11–14, 2013
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2013-22248
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A005, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73195
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A036, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73184
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A023, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73104
Proceedings Papers
Proc. ASME. IMECE2012, Volume 6: Energy, Parts A and B, 161-165, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-86623
Proceedings Papers
Proc. ASME. IMECE2010, Volume 5: Energy Systems Analysis, Thermodynamics and Sustainability; NanoEngineering for Energy; Engineering to Address Climate Change, Parts A and B, 569-576, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-37957
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 733-739, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52190
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