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Aaron Knobloch
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Journal Articles

Fabrication of Multimeasurand Sensor for Monitoring of a Li-Ion Battery

Aaron Knobloch, Chris Kapusta, Jason Karp, Yuri Plotnikov, Jason B. Siegel, Anna G. Stefanopoulou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031002.
Paper No: EP-17-1053
https://doi.org/10.1115/1.4039861
Published Online: May 11, 2018
View Article titled, Fabrication of Multimeasurand Sensor for Monitoring of a Li-Ion Battery
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Topics: Sensors, Manufacturing, Batteries, Design, Temperature
Proceedings Papers

Adhesive Tiecoat/Polyimide Interactions in High Temperature Flex Packaging

Harry Schoeller, Aaron Knobloch, Hua Xia, David Shaddock, Chris Kapusta, Kevin Durocher, Jungyun Cho
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 517-524, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33419
https://doi.org/10.1115/IPACK2007-33419
View Paper titled, Adhesive Tiecoat/Polyimide Interactions in High Temperature Flex Packaging
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Topics: Adhesives, High temperature, Packaging, Stress, Simulation, Adhesion, Elastic moduli, Finite element analysis, Electronic packages, Heat treating (Metalworking)
Proceedings Papers

Effects of Microstructure Evolution on High-Temperature Mechanical Deformation of 95Sn-5Sb

Harry Schoeller, Shubhra Bansal, Aaron Knobloch, David Shaddock, Junghyun Cho
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 25-32, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-68952
https://doi.org/10.1115/IMECE2008-68952
View Paper titled, Effects of Microstructure Evolution on High-Temperature Mechanical Deformation of 95Sn-5Sb
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Topics: Deformation, High temperature, Solders, Creep, Temperature, Alloys, Electronics, Stress, Tin, Drilling
Proceedings Papers

Constitutive Relations of High Temperature Solders

Harry Schoeller, Shubhra Bansal, Aaron Knobloch, David Shaddock, Junghyun Cho
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 201-208, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-42215
https://doi.org/10.1115/IMECE2007-42215
View Paper titled, Constitutive Relations of High Temperature Solders
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Topics: Constitutive equations, High temperature, Solders, Wire, Nanoindentation, Creep, Failure, Finite element analysis, Mechanical properties, Temperature