This article describes application of finite element analysis (FEA) in snap tool, developed by Snap-on Inc. in Kenosha, Wisconsin. FEA has been finding its way down the engineering chain with the help of easy-to-use software. FEA is the use of a complex system of points—called nodes—that form a grid, or mesh, across a model. The mesh contains the material and structural properties that define how the part will react to certain load conditions. Snap-on has discovered that if engineers analyze their products as they design them, they understand their products better and face fewer project delays. Engineers who use FEA have found that analyzing as they design parts saves development time. The Snap-on power tools group's move to integrated design and analysis should be complete by year's end. Mechanical failure often results from a variety of forces, including motion, stress, thermal and fluid-flow effects, and vibration. Multiphysics applications give engineers the ability to run all these analyses at the same time, to determine how the tower would withstand real-world conditions that occur simultaneously.
Skip Nav Destination
Article navigation
July 2001
Select Article
FEA in a Snap
A Toolmaker Finds that Finite Element Analysis isn't the Beast it Once Was.
Associate Editor
Mechanical Engineering. Jul 2001, 123(07): 60-62 (2 pages)
Published Online: July 1, 2001
Citation
Thilmany, J. (July 1, 2001). "FEA in a Snap." ASME. Mechanical Engineering. July 2001; 123(07): 60–62. https://doi.org/10.1115/1.2001-JUL-3
Download citation file:
465
Views
Get Email Alerts
Cited By
New “Flies” Around the Landfill
Mechanical Engineering (November 2024)
Below and Beyond
Mechanical Engineering (November 2024)
Hidden Infrastructure for the New Energy Economy
Mechanical Engineering (November 2024)
Autonomous Freight Takes to the Rail, Road, Sea, and Air
Mechanical Engineering (September 2024)
Related Articles
Design of a Dynamic Stabilization Spine Implant
J. Med. Devices (June,2009)
Data Interface Software for Windows PC-compatible Virtual Reality Scene Graphs
J. Comput. Inf. Sci. Eng (March,2002)
Effect of Chip and Pad Geometry on Solder Joint Formation in SMT
J. Electron. Packag (December,1993)
FEA ’s Flow to the Future
Mechanical Engineering (July,2000)
Related Proceedings Papers
Related Chapters
The Application of Finite Element Analysis Software ANSYS on the Design of Reciprocating Natural Gas Compressor
Proceedings of the International Conference on Technology Management and Innovation
A Multi-Channel Clustered Web Application Server: Architecture
International Conference on Future Computer and Communication, 3rd (ICFCC 2011)
Multi-Clustering Users in Twitter Dataset
International Conference on Software Technology and Engineering, 3rd (ICSTE 2011)