Stress Analysis of a Silicon-Wafer Slicer Cutting the Crystal Ingot

In-plane stress distribution in a spinning free-clamped slicing blade is studied analytically. The blade is subjected to a stationary, distributed, in-plane slicing load along the inner periphery, while it is clamped and tensioned initially in the radial direction along the outer boundary. The radial, hoop, and shear stresses in the blade are given by sum of the stresses from the tensioning, spinning, and edge loading. The solution is obtained by introducing the Laˆme potential functions and the two-dimensional elasticity theory. Numerical results are presented for an actual SUS301 blade cutting a 6-in.-diameter silicon ingot at 1550 rpm. Results obtained show that the contribution of the slicing load on the stress distribution is not significant; further the overall stress distribution is approximated by that of the initial tensioning except for the case of the shear stress distribution.