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Journal Articles

Study of Ductile-to-Brittle Transition in Single Grit Diamond Scribing of Silicon: Application to Wire Sawing of Silicon Wafers

Hao Wu, Shreyes N. Melkote
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research-Article
J. Eng. Mater. Technol. October 2012, 134(4): 041011.
https://doi.org/10.1115/1.4006177
Published Online: September 4, 2012
... of the diamond coated wire employed in fixed abrasive diamond wire sawing of photovoltaic silicon wafers. diamond scribing silicon modeling ductile-to-brittle transition crack scriber shape wire sawing While loose abrasive slurry sawing is the dominant process for producing photovoltaic (PV...
View Article titled, Study of Ductile-to-Brittle Transition in Single Grit Diamond Scribing of Silicon: Application to <span class="search-highlight">Wire</span> <span class="search-highlight">Sawing</span> of Silicon Wafers
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Topics: Brittleness, Cutting, Diamonds, Fracture (Materials), Friction, Sawing, Shapes, Silicon, Stress, Wire