... steady-state operation using a clamp-type ammeter. For the measured current of 0.1 A and input voltage of 27 V, the resulting power draw was 2.7 W. 23 06 2010 13 11 2010 05 01 2011 05 01 2011 curing hot pressing laminates moulding resins rubber sandwich structures...

... hot press at 1000 ° C with a heating rate of 10 ° C / min , a dwell time of 2 h and a bonding pressure of 10 MPa. Bond strength measurements show that the sample brazed with a nickel nanoparticle interlayer has the lowest void fraction at 4.8 ± 0.9 % and highest shear strength at 141.3 ± 7.0 MPa...

...), their best mechanical performances are close to those of solution treated compact AISI304 when Cu content is 3 wt % . 30 10 2008 05 06 2009 16 07 2009 copper densification hot pressing laser sintering powder metallurgy selective laser sintering isostatic pressing relative...